참고문헌
- Coombes, J. S., 1993: Platinum, Johnson Matthey, London, England
- lnnocenzo G. Casella, 1999: Electrocatalytic oxidation of oxalic acid on palladium based modified glassy carbon electrode in acidic medium, E1ectrochim. Acta 44(19), pp. 3353-3360 https://doi.org/10.1016/S0013-4686(99)00054-7
- Rovira, M. et al., 1998: Recovery of palladium (II) from hydrochloric acid solutions using impregnated resins containing Alumine 336, React. Funct. Polym. 38(2-3), pp. 279-287 https://doi.org/10.1016/S1381-5148(98)00038-8
- Lewis, F. A., 1967: The Palladium-Hydrogen System, Academic Press, New York, USA
- Decker, F. et al., 2000: Use of the bending-beam-method for the study of the anodic oxidation of Si in dilute fluoride media, Electrochim. Acta 45(28), pp. 4607-4613 https://doi.org/10.1016/S0013-4686(00)00612-5
- Santinacci, L. et aI., 2003: Selective palladium electrochemical deposition onto AFM-scratched silicon surfaces, Eelectrochim. Acta 48(20-22), pp. 3123-3130 https://doi.org/10.1016/S0013-4686(03)00340-2
- Huey-Ing Chen et al., 2003: Synthesis and characterization of palladium clusters dispersed alumina membranes, Separ. Purif. Technol. 32(1-3), pp. 247-254 https://doi.org/10.1016/S1383-5866(03)00066-2
- Robert H. Byrne, and Wensheng Yao, 2000: Formation of palladium (ll) hydroxychloride complexes and precipitates in sodium chloride solutions and seawater, Geochim. Cosmochim. Ac. 64(24), pp, 4153-4156 https://doi.org/10.1016/S0016-7037(00)00501-9
- Allen J. Bard, R. Parsons and J. Jordan, 1985: Standard Potentials in Aqueous Solution, pp. 343, International Union of Pure and Applied Chemistry, New York, USA
- Pletcher, D., 1982: Industrial Electrochemistry, pp. 176-182, Chapman and Hall, London, England
- Labat, S., Bocquet, F., Gilles, B. and Thomas. O.: Scripta Mater. in press
- Schlesinger, M. and Paunovic, M., 2000: Modern Electroplating, 4th ed., pp. 495-498, John Wiley & Sons, Inc., New York, USA
- Pina, J., Dias, A. M. and Lebrun, J.-L.: Proc. 6th European Conference on Residual Stresses, ed. by A. M. Dias (Trans Tech, 2002) pp. 683-690
- Thompson, E. R. and Lanless, K. R., 1969: Elastic strain in thin epitaxial electrodeposits of gold and nickel on copper, Electrochim. Acta 14(3), pp. 262-282
- Robert C. Cammarata, 1994: Surface and interface stress effects in thin films, Prog. Surf. Sci. 46(1), pp. 1-38 https://doi.org/10.1016/0079-6816(94)90005-1
- Spaepen, F., 2000: Interfaces and stresses in thin films, Acta Mater. 48(1), pp. 31-42 https://doi.org/10.1016/S1359-6454(99)00286-4
- Armyanov, S. and Sotirova, G, 1982: Residual stress diagrams for electrodeposited metal coatings I: Plotting the residual stress diagrams during the anodic dissolution of metal coatings using the length change method, Surf. Technol. 17(4), pp. 329-340 https://doi.org/10.1016/0376-4583(82)90072-3
- Jingxian Yu et al., 2003: Temperature Effects on the Electrodeposition of Zinc, J. Electrochem. Soc. 150, pp. C19-C23 https://doi.org/10.1149/1.1525269
- Budevski, E., Staikov, G. and Lorenz, W. J., 1996: Electrochemical Phase Formation and Growth, pp. 149-157, VCH, New York, USA