Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 12 Issue 4 Serial No. 37
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- Pages.275-280
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
UV-nanoimprint Patterning Without Residual Layers Using UV-blocking Metal Layer
UV 차단 금속막을 이용한 잔류층이 없는 UV 나노 임프린트 패턴 형성
- Moon Kanghun (Division of Advanced Materials Science and Engineering, Hanyang University) ;
- Shin Subum (Hynix Semiconductor Inc.) ;
- Park In-Sung (Information Display Research Institute, Hanyang University) ;
- Lee Heon (Division of Materials Science and Engineering, Korea University) ;
- Cha Han Sun (S&S Tech Co. Ltd) ;
- Ahn Jinho (Division of Advanced Materials Science and Engineering, Hanyang University)
- 문강훈 (한양대학교 신소재공학부) ;
- 신수범 (하이닉스 반도체) ;
- 박인성 (한양대학교 디스플레이공학연구소) ;
- 이헌 (고려대학교 재료공학부) ;
- 차한선 ;
- 안진호 (한양대학교 신소재공학부)
- Published : 2005.12.01
Abstract
We propose a new approach to greatly simplify the fabrication of conventional nanoimprint lithography (NIL) by combined nanoimprint and photolithography (CNP). We introduce a hybrid mask mold (HMM) made from UV transparent material with a UV-blocking Cr metal layer placed on top of the mold protrusions. We used a negative tone photo resist (PR) with higher selectivity to substrate the CNP process instead of the UV curable monomer and thermal plastic polymer that has been commonly used in NIL. Self-assembled monolayer (SAM) on HMM plays a reliable role for pattern transfer when the HMM is separated from the transfer layer. Hydrophilic
나노 임프린트 (NIL)와 포토 리소그라피를 접목시킨 combined nanoimprint and photolithography (CNP) 기술을 이용하여 나노 미세 패턴을 형성하였다. 일반적인 UV-NIL 스탬프의 양각 패턴 위에 Cr 금속막을 입힌 hybrid mask mold (HMM)을 E-beam writing과 plasma etching으로 제작하였다. HMM 전면에는 친수성 물질인