Applied Chemistry for Engineering (공업화학)

The Korean Society of Industrial and Engineering Chemistry (한국공업화학회)
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Curing Process of Phenolic Resin

페놀 수지의 경화 공정

  • Lee, Yoon Bae (Department of Chemical Engineering, Soonchunhyang University) ;
  • Sung, Si Chang (Department of Chemical Engineering, Soonchunhyang University) ;
  • Shin, Eun Jung (Department of Chemical Engineering, Soonchunhyang University)
  • 이윤배 (순천향대학교 화학공학과) ;
  • 성시창 (순천향대학교 화학공학과) ;
  • 신은정 (순천향대학교 화학공학과)
  • Received : 2004.08.17
  • Accepted : 2004.12.09
  • Published : 2005.04.10
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Abstract

The curing time of the phenolic resin for the processing of brake pad is very important factor for reducing the processing cost. The curing time could be investigated by examining the reaction time of the phenolic resin and hexamethylenediamine. The reaction time has been studied by FT-IR, Differential Scanning Calolimetric Analysis (DSC), and Thermogravimetric Analysis (TGA).

자동차 브레이크 패드 만들 때 페놀 수지의 경화 시간은 원가 질감의 중요한 요인이 된다. 이 경화 시간은 페놀수지와 경화제인 Hexamethylenetetramine의 반응 시간을 측정함으로써 알 수 있다. 이 반응 시간은 적외선 분광법(FT-IR), 열치사 주사법(DSC) 및 열중량 분석법(TGA)에 의하여 화학 반응의 완결을 추적하여 알아낼 수 있었다.

Keywords

References

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