Korean Chemical Engineering Research

The Korean Institute of Chemical Engineers (한국화학공학회)
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A Study on the Electroplating using Macroemulsion in High Pressure

고압 매크로에멀젼을 이용한 전해도금에 관한 연구

  • Park, Ji-Young (Environmental & Process Technology Division, Clean Technology Research Center, KIST) ;
  • Yang, Jun Youl (Environmental & Process Technology Division, Clean Technology Research Center, KIST) ;
  • Suh, Dong Jin (Environmental & Process Technology Division, Clean Technology Research Center, KIST) ;
  • Yoo, Ki-Pung (Department of Chemical and Biomolecular Engineering, Sogang University) ;
  • Lim, Jong Sung (Department of Chemical and Biomolecular Engineering, Sogang University)
  • 박지영 (한국과학기술연구원 환경공정연구부 청정기술연구센터) ;
  • 양준열 (한국과학기술연구원 환경공정연구부 청정기술연구센터) ;
  • 서동진 (한국과학기술연구원 환경공정연구부 청정기술연구센터) ;
  • 유기풍 (서강대학교 화공생명공학과) ;
  • 임종성 (서강대학교 화공생명공학과)
  • Received : 2004.02.24
  • Accepted : 2004.11.12
  • Published : 2005.02.28
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Abstract

In this study, the supercritical electroplating was investigated by forming macroemulsion of electroplating solution using surfactant in supercritical $CO_2$. The fluorinated analogous AOT surfactant, sodium salt of bis (2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate which has both '$CO_2$ philic' chains and 'hydrophilic' head group was used as a surfactant, and Ni plate and Cu plate were used as the anode and the cathode, respectively. Electroplating was carried out in the conventional method and the supercritical macroemulsion and both results were compared. The supercritical electroplating was carried out in various concentration of surfactant such as 2, 4, 7 wt%, the volume ratio of Ni-plating solution to $CO_2$ was varied in the range of 10-70 vol%, and propane was used as a supercritical fluid instead of $CO_2$. According to the experimental results, the plated surface of Ni on Cu plate performed in supercritical macroemulsion was better than that, in conventional state. In the image of Ni surface plated on Cu plate in supercritical state, there were fewer pin-holes and pits comparing with that in the conventional process. The current and conductivity was increased as the volume ratio of Ni-plating solution to $CO_2$ was increased and the current and the amount of Ni plated on Cu plate were decreased as the concentration of surfactant become higher. In addition, in case of the continuous phase, using $CO_2$ was more effective than using $CO_2$.

본 연구에서는 계면활성제를 이용하여 초임계이산화탄소와 전해도금액의 매크로에멀젼을 형성한 후 양극과 음극을 통해 통전시켜 초임계에멀젼 전해도금을 수행하였다. 계면활성제로는 친이산화탄소기와 친수기를 동시에 지닌 sodium salt of bis (2,2,3,3,4,4,5,5-octafluoro-1-pentanol) sulfosuccinate를 사용하였으며 (+)극과 (-)극으로 니켈판과 구리판을 각각 사용하였다. 초임계매크로에멀젼 상태에서 도금된 니켈표면과 기존의 상압 상태에서 도금된 니켈표면을 비교해 본 결과 이산화탄소/니켈도금액 매크로에멀젼에 의해 도금된 니켈표면은 기존 방법에 의한 것보다 더 균일하였다. 계면활성제의 농도와 도금액 양이 도금에 미치는 영향을 살펴보기 위하여 도금액에 첨가한 계면활성제의 농도를 2, 4, 7 wt% 변화시켰으며 도금 반응셀 내에서 차지하는 도금액의 부피를 10 vol%에서 70 vol%까지 증가시켰다. 그리고 연속상의 영향을 알아보기 위하여 초임계이산화탄소 대신에 프로판을 사용하여 그 결과를 살펴보았다. 매크로에멀젼이 형성되는 농도 이상에서는 계면활성제의 농도가 높아질수록 전류량과 도금되는 니켈 양이 모두 감소하였으며, 도금액의 부피가 증가할수록 전류량과 전기전도도가 높아지고 도금되는 니켈 양이 증가하였다. 또한, 연속상의 경우, 프로판보다 이산화탄소가 우수한 도금효과를 보임을 알 수 있었다.

Keywords

Acknowledgement

Supported by : 에너지관리공단

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