Journal of Mechanical Science and Technology

The Korean Society of Mechanical Engineers (대한기계학회)
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Non-Destructive Evaluation of Semiconductor Package by Electronic Speckle Pattern Interferometry

  • Kim, Koung-Suk (Department of Mechanical Design Engineering, Chosun University) ;
  • Kang, Ki-Soo (Department of Mechanical Design Engineering, Graduate School, Chosun University) ;
  • Jung, Seung-Tack (Sairon Technology, Inc.)
  • Published : 2005.03.01
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Abstract

This paper proposes non-destructive ESPI technique to evaluate inside defects of semiconductor package quantitatively. Inspection system consists of ESPI system, thermal loading system and adiabatic chamber. The technique has high feasibility in non-destructive testing of semiconductor and gives solutions to the drawbacks in previous technique, time-consuming and the difficulty of quantitative evaluation. In result, most of defects are classified in delamination, from which it is inferred to the insufficiency of adhesive strength between layers and nonhomogeneous heat spread. The $90\%$ of tested samples have a delamination defect started at the around of the chip which may be related to heat spread design.

Keywords

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