Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 12 Issue 1 Serial No. 34
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- Pages.41-46
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- 2005
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Correlation between Interfacial Reaction and Brittle Fracture Found in Electroless Ni(P) Metallization
계면 화학반응과 무전해 니켈 금속층에서 나타나는 취성파괴와의 연관성에 관한 연구
- Sohn Yoon-Chul (Dept. of Materials Science and Engineering, KAIST) ;
- Yu Jin (Dept. of Materials Science and Engineering, KAIST)
- Published : 2005.03.01
Abstract
A systematic investigation of shear testing was conducted to find a relationship between Ni-Sn intermetallic spatting and the brittle fracture observed in electroless Ni(P)/solder interconnection. Brittle fracture was found in the solder joints made of Sn-3.5Ag, while only ductile fracture was observed in a Cu-containing solder (Sn-3.0Ag-0.5Cu). For Sn-3.0Ag-0.5Cu joints,
무전해 Ni(P)과 솔더와의 반응 중 발견되는 취성파괴 현상과 계면 화학반응시의 금속간화합물 spalling과의 연관성을 전단 파괴실험을 통하여 체계적으로 연구하였다. 취성파괴는 무전해 Ni(P)과 Sn-3.5Ag 솔더와의 반응 후에만 나타났고 Sn-3.0Ag-0.5Cu 솔더와의 반응시에는 연성파괴만이 관찰되었다. Sn-3.0Ag-0.5Cu 솔더와의 반응시