DOI QR코드

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이온빔에 의한 Cu/Polyimide 표면개질에 따른 접착력향상에 관한 연구

A Study on the Improvement of Adhesion according to the Surface Modification of Cu/Polyimide Films by ion Beam Irradiation

  • 신윤학 (충북대학교 공과대학 재료공학과) ;
  • 추준식 (충북대학교 공과대학 재료공학과) ;
  • 이승우 (충북대학교 공과대학 재료공학과) ;
  • 정찬회 (충북대학교 공과대학 재료공학과) ;
  • 김명한 (충북대학교 공과대학 재료공학과)
  • Shin Youn-Hak (Department of Materials Engineering, Chungbuk National University) ;
  • Chu Jun-Sick (Department of Materials Engineering, Chungbuk National University) ;
  • Lee Seoung-Woo (Department of Materials Engineering, Chungbuk National University) ;
  • Jung Chan-Hoi (Department of Materials Engineering, Chungbuk National University) ;
  • Kim Myung-Han (Department of Materials Engineering, Chungbuk National University)
  • 발행 : 2005.01.01

초록

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

키워드

참고문헌

  1. R. R. Tummala and E. J. Rymaszewski (eds), Microelectronics Packaging Handbook, VNR, New York, 673 (1989)
  2. C. C. Chao, K. S. Scholz, J. Leibovitz, M. Cobarruiaz and C. C. Chung, IEEE Trans. Comp. Hybrids Manuf. Tech, 12, 180 (1989) https://doi.org/10.1109/33.31422
  3. C. W. Ho, D. A. Chance, C. H. Bajorek and R. E. Acosta, IBM J. Res. Develop., 26, 286 (1982) https://doi.org/10.1147/rd.263.0286
  4. D. A Doane and P. D. Franzon, Multichip Module Technologies and Alternatives, VNR, New York, 403 (1993)
  5. J. H. Lau, Handbook of Tape Automated Bonding, VNR, New York 1 (1992)
  6. B. Chapman, Glow Discharge Processes, John Wiley & Sons, New York, 201 (1980)
  7. B. Navinek, V. Marinkovic, M. Osredkar and G. Carter, Rad. Effects, 3, 115 (1970) https://doi.org/10.1080/00337577008235623
  8. C. J. Beevers and R. S. Nelson, Phil. Mag., 8, 1189 (1963) https://doi.org/10.1080/14786436308207344
  9. S. Han, Surface Modification of Polymers by Ion beam Irradiation, Yonsei Univ, Seoul, 80 (1999)
  10. A. D. G. Stewart and Ph. D. Thesis, Cambridge (1962) and Proc. V. Int. Congo on Electron Microscopy, Philadelphia, Academic press, New York, D12 (1962)
  11. A. D. G. Stewart and Ph. D. Thesis, Cambridge (1962) and Proc. V. Int. Congo on Electron Microscopy, Philadelphia, Academic press, New York, D12 (1962)
  12. Y Suzuki, M. Kusakabe and M. Iwaki, Nuclear Instrument and Methods in Physics Research, B80/81, 1067 (1993) https://doi.org/10.1016/0168-583X(93)90738-R
  13. J. Kim, K. S. Kim and Y. H. Kim, J. Adhension Sci. Tech., 3, 175 (1989) https://doi.org/10.1163/156856189X00146
  14. G. Beamson and D. Briggs, High Resolution XPS of Organic Polymers, John Wiley & Sons, New York (1992)
  15. H. Y. Lee, KAIST, Mat. Sci. Eng., A311, 217 (2001)
  16. R. J. Good, Contact Angle, Wettability and Adhesion, ed. K. L. Mittal (VSP BV, Urecht, Netherlands, 1993) p. 3