References
- R. M. German, K. F. Hens and J. L. Johnson, Int. J. Powder Matall.,30(1994) 205
- N.L.OH, D.G.Kim, M.J. Suk, Y.H. Kim, Y.D. Kim, I.H.Moon, 'The Evaluation of Thermal for W-Cu Composite Sintered from Mechanically Alloyed Powders', J. Powder Metall., Vol 7, NO 3, 2000
- A.L.Eustice, S.J.Horowitz, J.J.Stewart, A.R.Travis, and H.T.Sawhill. 'Low Temperature Cofireable Ceramics: A Now Approach for Electronic Packaging,' in Proc. Electronic Components Conf., pp.37-47. 1986
- W. S. Young, Multilayer Ceramic Technology, in Ceramic Materials for Electronics, edited by R.C.Buchman, Marcel-Dekker, New York, 403-424(1988)
- F.J.Dance and J.L.Wallace, 'Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip Carriers,' Electron. Pack. Product., pp.226-237, Jan. 1982
- K. V. Sebastian, Int. J. Powder Metall. & Powder Tech.,17(1981)297
- I.-H. Moon and J. S. Lee, Powder Metall., 1(1979)5
- B. Yang and R. M. German, Int. J. Powder Metall., 33(1997)55
- 오영제, 정형진, '세라믹스 테이프케스팅(Tape Casting) 성형기술', 요업기술, Vol 12, No 1, pp.3-11(1997)
- P.S.Turner, J .Res. NBS., Vol 37, pp.239, 1946
- J.F.Kerrisk, J. Appl. Phys., Vol 43, pp.112, 1972
- J.C.Maxwell, A Treatise on Electricity and Magnetism, (3rd Ed.), Oxford U.P, Oxford, pp.63, 1982