Elucidation of the Noise in Corrosion of Aluminum Foil

  • Chiba, Atsushi (Department of Materials Chemistry, Faculty of Engineering, Yokohama National University) ;
  • Hattori, Atsushi (Department of Materials Chemistry, Faculty of Engineering, Yokohama National University) ;
  • Wu, Weng-Chang (Department of Chemical Engineering, Southern Taiwan of Technology)
  • Published : 2004.06.01

Abstract

Al foil used was 99.9 and 99.99 %. Test solution used was NaCl solution. The noise was determined using controlled potential electrolysis at -200 and -700 mV vs. NHE. The current fluctuation was caused by breakdown and repaired process of aluminum oxide film. The current fluctuation value of noise was proportion to degree of growth. The number of noise was proportion to the number of pit. The examining of current flutulation value and number of noise could be evaluated corrosion. A 99.99 % Al foil was the mostly crystal of {100} plane, and showed three-dimensional, as azimuth pit with along the direction of this place piled up. A 99.9 % Al foil was polycrystal, and in order of (311) >(222) >(200) >(111) plane. The azimuth pit did not occurred as the dissolution was occurred from each plane.

Keywords

References

  1. A. Aballe, M. Bethencourt, F. J. Botana, and M. Marcos, Electrochem. Comm., 1, 266 (1999)
  2. Y. F. Cheng, M. Wilmott, and J. L. Luo, Corros. Sci, 41, 1245 (1999)
  3. A. Legat, J. Osredkar, V. Kuhar, and M. Leban, Materials Science Forum, 289, part 2, 807 (1998)
  4. F. Mansfeld, C. C. Lee, and G. Zhang, Electrochim. Acta, 43, 435 (1998) https://doi.org/10.1016/S0013-4686(97)00060-1
  5. F. Mansfeld, Z. Sun, C. H. Hsu, and A. Nagiub, Corros. Sci., 43, 341 (2001)
  6. C. Monticelli, G. Trabanelli, and G. Meszaros, J Appl. Electroanal., 28, 963 (1998)
  7. Y. F. Cheng, J. L. Luo, and M. Wilmott, Electrochim. Acta, 45, 1763 (2000)
  8. A. Aballe, M. Bethencourt, F. J. Botana, and M. Marcos, Electrochim. Acta, 44, 4805 (1999)
  9. G. L. Edgemon, M. J. Denielson, and G. E. C. Bell, J Nucl. Mater., 245, 201 (1997)
  10. C. Monticelli, F. Zucchi, G. Brunoro, and G. Trabanelli, J AppI. Electroanal., 27, 325 (1997)
  11. J. Tan,Y. S. Bailey, and B. Kinsella, Corros. Sci., 38, 1681 (1996)
  12. J. F. Chen and W. F. Bogaerts, Corros. Sci., 37, 1839 (1995)
  13. Y. F. Cheng, M. Wilmott, and J. L. Luo, Corros. Sci., 41, 1245 (1999)
  14. F. Mansfeld, C. Chen, C. Lee, and H. Xiao, Corrps. Sci., 38, 497 (1996)
  15. T. Fukuda and T. Mizuno, Corros. Sci., 38, 1085 (1996)
  16. L. Michelutti, N. Mathieu, A. Chovet, and A. Galerie, Microelectronics Relibility, 40, 179 (2000)
  17. A. Chiba, O. Nakano, W. C. Wu, T. Meguro, and K. Kobayashi, Proceedings in The 9$^th$ Asian-Pacific Corrosion Control Conference, p.905 (1995)(Taiwan)
  18. A. Chiba, K. Kawazu, O. Nakano, T. Tamura, S. Yoshihara, and E. Sato, Corros. Sci, 36, 539 (1994)
  19. W-J. Lee and S-I Pyun, Electrochim. Acta; 44, 4041 (1999)
  20. W-1. Lee and S-I Pyun, Electrochim. Acta, 45,1901 (2000)