References
- G. S. Nolas, D. T. Morelli and T. M. Tritt, Annu. Rev. Mater. Sci., 29, 89 (1999) https://doi.org/10.1146/annurev.matsci.29.1.89
- G. S. Nolas, H. B. Lyon, J. L. Cohn, T. M. Tritt and G. A. Slack, 16th Intl. Conf. on Thermoelectrics, Dresden, Germany, 1997, IEEE, pp. 321-325
- T. Caillat, A. Borschchevsky and J.- P. Fleurial, J. Appl. Phys., 80(8), 4442 (1996) https://doi.org/10.1063/1.363405
- J. W. Sharp, E. C. Jones, R. K. Williams, P. M. Martin and B. C. Sales, J. Appl. Phys., 78(2), 1013 (1995) https://doi.org/10.1063/1.360402
- T. Caillat, A. Borshchevski and J.-P. Fleurial, 13th Intl. Conf. Thermoelectrics, Kansas City, Missouri, USA, American Institute of Physics, (1994), pp. 58-61
- J. Yang, Y. C. Chen, J. Peng, X, Song, W. Zhu, J. Su and R. Chen, J. of Alloying and Compound, 375, 229 (2004) https://doi.org/10.1016/j.jallcom.2003.11.036
- Y. Kawaharada, K. Kurosaki, M. Uno and S. Yamanaka, J. of Alloying and Compound, 315, 193 (2001) https://doi.org/10.1016/S0925-8388(00)01275-5
- J. X. Jang, Q. M. Lu, K. G. Liu, L. Zhang and M. L. Zou, Materials Letters, 58, 1981 (2004) https://doi.org/10.1016/j.matlet.2003.11.032
- S.-C. Ur, P. Nash and I.-H. Kim, J. of Alloys and Compounds, 361(1), 84 (2003) https://doi.org/10.1016/S0925-8388(03)00418-3
- D. M. Rowe and V. S. Schukla, J. Appl. Phys., 52(12), 7421 (1981) https://doi.org/10.1063/1.328733