Pattern Formation by the watersoluble PSR ink

수성 PSR 잉크를 이용한 패턴 형성

  • Lee, Myung-Su (Division of Image & Information, College of Engineering, Pukyong National University) ;
  • Kim, Young-Bea (Division of Image & Information, College of Engineering, Pukyong National University) ;
  • Nam, Su-Yong (Division of Image & Information, College of Engineering, Pukyong National University)
  • 이명수 (부경대학교 공과대학 화상정보공학부) ;
  • 김영배 (부경대학교 공과대학 화상정보공학부) ;
  • 남수용 (부경대학교 공과대학 화상정보공학부)
  • Published : 2004.03.01

Abstract

PSR ink is used to insulation coating material that heat resistance is. The use purpose is used for bridge prevention, circuit protection, stabilization of insulation. Heat-cured resin was used mainly on the materials of PSR inks. But, UV-curing type resin in used. Also, because of recently environmental problem, ink is going to water type. Purpose of this study is to develop PSR ink that can develop in pure water. and experiment did that do from that find suitable oligomer and monomer and does brand ratio differ. Specially Knew that is extent water soluble UV resin develop possible is DPHA 10~50% that A/A1924 is 50~90wt %, monomer. As a result, when ratio of A/A1924 and DPHA low viscosity epoxy resin is 5:1.5:1.5, could get high sensibility pattern repeatability, tack and alkali-resistance.

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