Mulit-Layer Directional Coupler With Enhaned Coupling and Isolation

개선된 결합도와 격리도 특성을 갖는 다층 방향성 결합기

  • 박정훈 (시립인천전문대학교 정보통신과) ;
  • 이진택 (아주대학교 전자공학과) ;
  • 천동완 (아주대학교 전자공학과) ;
  • 신철재 (아주대학교 전자공학과)
  • Published : 2004.10.01

Abstract

In this paper, we proposed the directional coupler using two layer microstrip substrate which is improved coupling and isolation. Modified two-layer directional coupler is the structure which is added to the one-layer on the signal line and located the floating conductor on the added layer. Also, we applied the aperture on the ground plane in order to enhancing the coupling value, and located the conductor in order to enhancing the isolation and VSWR according to S$_{11}$. As a result, proposed two-layer directional coupler has about 2 dB more higher coupling and 20 dB more higher isolation than conventional couplerer

본 논문에서는 이중충 마이크로스트립 유전체 기판을 이용하여 개선된 결합도와 격리도 특성을 갖는 방향성 결합기를 제안하고, 그 설계방법을 제시하였다. 제안한 구조는 전송선로 위에 한 충의 유전체를 추가시키고 그 위에 부동도체를 위치시킨 구조로써 접지면에 어퍼쳐를 적용하여 결합도를 향상시키고, 접지면 어퍼쳐 안에 도체를 위치시켜 격리도와 S$_{11}$ 대한 정재파비를 개선하였다. 그 결과 개선된 이중층 방향성 결합기는 기존의 re-enfant mode 방향성 결합기보다 2 dB의 향상된 결합도와 대역내에 20 dB 이상의 향상된 격리도와 S$_{11}$에 대한 정재파비를 가졌다.

Keywords

References

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