무전해 니켈 도금용액에 사용되는 안정제의 도금피막 특성에 미치는 영향

The Effect of Stabilizers on the Characteristics of Deposit in the Electroless Nikel Plating

  • 발행 : 2004.12.01

초록

Bath stabilizers in the electroless nickel(EN) plating solution are known to prevent sudden bath decomposition and extend its lifetime. Further, every stabilizer has a different role and function in EN solution and it influences the surface structure. In this study, the effects of various stabilizers on the deposition rate, surface morphology, deposition content of phosphor and hardness were investigated.

키워드

참고문헌

  1. A. Wurtz, C. R. Hebd, Seances Acad, Sci., 18 (1844) 702
  2. Han Keping, Jing Li Fang, Metal Finishing, (1997) 73-75
  3. A. Brenner, G.B. Riddell, J. Res, Nat. Bur. Stand, 37 (1946) 31-34
  4. U.S.-Patent, (1916) 1.207.218
  5. A. Brenner, G. E. Riddell, J. Res, Nat. Bur. Stand, 39 (1946) 385-395
  6. Hiroshi Matsubara, Takehide Yonekawa et aI., Electrochimica Acta, 47 (2002) 4011-4018 https://doi.org/10.1016/S0013-4686(02)00322-5
  7. Kwang Lung Lin, lia wei Hwang, Materials Chemistry and Physics, 76 (2002) 204-211
  8. Seung Jun Jung, Soo Gil Park, J. Electrochem. Soc., 3 (2000) 196-199
  9. Georgi G. Gawrilov, Chemische Vemicklung, Eugen G. Leuze Verlag, (1974)
  10. Wolfgang Riedel, Funktionelle Chemische Vemicklung, Eugen G. Leuze Verlag, (1989)
  11. G. Gutzeit, Plating, 46 (1960) 58-64, 47, 1275-78, 48, 1377-78.
  12. G. Schmitt, Galvanotechnik. 59, (1968) 666-669
  13. K. Schwitzgebel, Metalloberflache, 19 (1965) 390-391
  14. W. J. Cheong et aI., Appl. Surf. Sci., 229 (2004) 282-300 https://doi.org/10.1016/j.apsusc.2004.02.003
  15. H. Honma, Eelctrochimica Acta, 47 (2001) 75-84.s https://doi.org/10.1016/S0013-4686(01)00591-6