반도체디스플레이기술학회지 (Journal of the Semiconductor & Display Technology)
- 제3권3호
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- Pages.11-17
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- 2004
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- 1738-2270(pISSN)
COF(Chip On Film)에서의 Polyimide/Buffer layer/Cu 접착력 향상
Adhesive improvement of the Polyimide/Buffer layer/Cu at the COF(Chip On Film)
초록
This research has been progressed for adhesive improvement of the Polyimide/Buffer layer/Cu at the COF(Chip On Film) which induced as the alternative plan about high concentration of a circuit or substrates according to demands of miniaturization and high efficiency of various electronic equipment. RF plasma equipment was applied to when plama pretreatment was performed for improvement of adhesive strength of PI and Cr as the buffer layer. Experimental fluents were a species of the buffer layer, depositied time and the ratio of