Journal of the Institute of Electronics Engineers of Korea SD (대한전자공학회논문지SD)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Fabrication of novel micromachined microstrip transmission line for millimeter wave applications

마이크로머시닝 기술을 이용한 새로운 형태의 고주파 저손실 Microstrip 전송선의 제작

  • 이한신 (동국대학교 밀리미터파 신기술 연구센터) ;
  • 김성찬 (동국대학교 밀리미터파 신기술 연구센) ;
  • 임병옥 (동국대학교 밀리미터파 신기술 연구센) ;
  • 신동훈 (동국대학교 밀리미터파 신기술 연구센) ;
  • 김순구 (동국대학교 밀리미터파 신기술 연구센) ;
  • 박현창 (동국대학교 밀리미터파 신기술 연구센) ;
  • 이진구 (동국대학교 밀리미터파 신기술 연구센터)
  • Published : 2004.08.01
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Abstract

This paper describes a new GaAs-based surface-micromachined microstrip line supported by dielectric post and air-gapped signal line with ground metal. This new type of dielectric-supported air-gapped microstripline(DAML) structure is developed using surface micromachining techniques to provide easy means of airbridge connection between the signal lines and to archive low losses at millimeter-wave frequency band with wide impedance range. Each DAMLs with the length of 5 mm are fabricated and the measured characteristics are compared with those of the conventional microstrip transmission line. These transmission lines are composed of 10 ${\mu}{\textrm}{m}$ height of signal line, post size of 10 ${\mu}{\textrm}{m}$ ${\times}$ 10 ${\mu}{\textrm}{m}$ and post height of 9 ${\mu}{\textrm}{m}$. By elevating the signal lines from the substrate using the micromachining technology, the substrate dielectric loss can be reduced Compared with of the conventional microstrip transmission line showing 7.5 dB/cm loss at 50 GHz, the loss can be reduced to 1.1 dB/cm loss at 50 GHz.

본 논문에서는 RF 부품 수동소자 중 가장 기본적인 요소가 되는 전송선로를 DAML(Dtelectric-supported Airbridge Microstrip Line) 형태의 새로운 구조로 제안하였으며, DAMS(Micro Electro Mechanical System) 기술 중 표면 마이크로머싱닝(surface micromachining) 기법을 이용하여 구현하였다. 제안된 구조는 마이크로스트립 라인(microstrip line)의 응용 형태로서 기존의 신호선(signal line)과 ground 사이에 유전체 지지대(dielectric post)를 사용하였고, 신호선을 공중으로 띄우면서 넓은 범위의 임피던스에서 유전체 손실(dielectric loss)을 최소화하였다. 본 논문에서 제작된 전송선로는 10 ㎛의 신호선의 높이와 10 ㎛ × 10 ㎛의 지지대(Post) 면적과 9 ㎛의 지지대(post)의 높이와 5 mm의 길이로 제작되었다. 50 GHz에서 일반적인 마이크로스티립(microstrip) 전송선의 손실이 약 7.5 dB/cm 이상 되는 것과 비교하여 본 논문에서 제안한 구조에서는 50 GHz에서 전송선의 손실이 약 1.1 dB/cm가 되는 것을 얻었다.

Keywords

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