Thermal Analysis of Wall/Floor Intersections in Building Envelope

  • Ihm, Pyeongchan (Joint Center for Energy Management, CEAE Department CB 428, University of Colorado)
  • 발행 : 2004.06.01


Wall/floor intersection is important parts of a building envelope system. These intersections can be sources of thermal bridging effects and/or moisture condensation problems. This paper provides a detailed analysis of the thermal performance of wall/floor intersection. In particular, two-dimensional steady-state and transient solutions of the heat conduction within the wall/floor joint are presented. Various insulation configurations are considered to determine the magnitude of heat transfer increase due to wall/floor joint construction.



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