Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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The Effect of Additives on the Deposition Rate and the Surface Morphology of Trivalent Chromium Electrodeposits

3가 크롬도금의 전착속도 및 표면형상에 미치는 첨가제의 영향

  • 예길촌 (영남대학교 재료금속공학부) ;
  • 서경훈 (영남대학교 재료금속공학부)
  • Published : 2004.02.01
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Abstract

The deposition rate, the current efficiency and surface morphology of trivalent Cr deposits were investigated according to additives in sulfate bath and current density. The deposition rate of the Cr deposits plated from the formic acid complexed bath was noticeably higher than that of the glycine complexed bath. The current efficiency of the deposition from formic acid bath was higher than that of the glycine bath and increased with current density in the range of 20-50 A/d$\m^2$. The current efficiency of the deposition from the formic acid bath with boric acid buffer was higher than that of the bath with aluminum sulfate or boric acid-aluminum sulfate buffers. The nodular crystallite size of the Cr deposits increased with current density and the uniform and crack-free growth of the deposits for the aluminum sulfate was observed compared to the other buffers.

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