초록
PZT 박막을 rf-마그네트론 스퍼터링으로 $Pt/Ti/SiO_2/Si$ 기판 위에 형성시켰다. $5\%$ 과잉 PbO 를 포함한 bulk PZT 타겟을 사용하였다. 상온에서 PZT 박막을 얇게 입힌 후 나머지 두께를 $650^{\circ}C$에서 in-situ 방법으로 형성시켰다. 강유전 특성을 갖는 PZT 상은 $650^{\circ}C$에서 형성되었다. 2단계 스퍼터링에 의해 누설전류 특성을 크게 증진시킬 수 있었고, 적절한 두께의 상온층을 포함시킨 경우 $2{\times}10^{-7}A/cm^2$의 매우 작은 누설전류를 나타냈다. 누설전류 기구에 대한 조사 결과, 여러 조건에서 제조된 PZT 박막의 전기전도는 모두 bulk-limit 기구에 의한 것임을 알 수 있었다.
PBT thin films were formed by rf-magnetron sputtering on $Pt/Ti/SiO_2/Si$ substrate. Bulk-PZT target containing $5\%$-excess PbO was used. After PZT thin films had been deposited at room temperature, remaining portion of the thin film was formed by in-situ process. The ferroelectric perovskite phase was formed at $650^{\circ}C$. The leakage current property was improved dramatically by 2-step sputtering, and in the sample containing optimum thickness of room temp.-layer very low leakage current of $2{\times}10^{-7}A/cm^2$ was shown. As a result of the investigation on the leakage current mechanism, the electrical conduction mechanism in all PZT thin films formed by several conditions was confirmed as bulk-limited mechanism.