Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)
- Volume 11 Issue 3 Serial No. 32
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- Pages.37-45
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- 2004
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Spalling of Intermetallic Compound during the Reaction between Electroless Ni(P) and Lead-free Solders
무전해 Ni(P)과 무연솔더와의 반응 중 금속간화합물의 spalling 현상에 관한 연구
- Sohn Yoon-Chul (Dept. of Materials Science and Engineering, KAIST) ;
- Yu Jin (Dept. of Materials Science and Engineering, KAIST) ;
- Kang S. K. (IBM T. J. Watson Research Center, NY, USA) ;
- Shih D. Y, (IBM T. J. Watson Research Center, NY, USA) ;
- Lee Taek-Yeong (Dept. of Materials Engineering, Hanbat National University)
- Published : 2004.09.01
Abstract
Electroless Ni(P) has been widely used for under bump metallization (UBM) of flip chip and surface finish layer in microelectronic packaging because of its excellent solderability, corrosion resistance, uniformity, selective deposition without photo-lithography, and also good diffusion barrier. However, the brittle fracture at solder joints and the spatting of intermetallic compound (IMC) associated with electroless Ni(P) are critical issues for its successful applications. In the present study, the mechanism of IMC spatting and microstructure change of the Ni(P) film were investigated with varying P content in the Ni(P) film (4.6,9, and
무전해 Ni(P)는 솔더링 특성과 부식저항성이 우수하고 표면 거칠기가 적으며 원하는 금속 상에 선택적으로 도금이 가능하여 전자패키지에서 반도체칩과 기판의 표면 금속층으로 촉 넓게 사용되고 있다. 그러나 솔더와의 반응 중 금속간 화합물의 spalling과 솔더 조인트에서의 취성파괴 문제가 성공적인 적용의 걸림돌이 되어 왔다. 본 연구에서는 각각 조성이 다른 세가지 Ni(P)막 (4.6,9, and