A Numerical Study on Combined Solution and Evaporation during Spin Coating Process

Wafer Spin Coating 공정에서 증발과 용액이 박막 형성에 미치는 영향에 관한 연구

The fluid flow, mass transfer, heat transfer and film thickness variation during the spin coating process are numerically studied. The model is said to be I-dimensional because radial variations in film thickness, concentration and temperature are ignored. The finite difference method is employed to solve the equations that are simplified using the similarity transformation. In early time, the film thinning is due to the radial convective outflow. However that slows during the first seconds of spinning so the film thinning due to evaporation of solvent becomes sole. The time varing film thickness is analyzed according to the wafer spin speed, the various solvent fraction in the coating liquid, and the various solvent vapor fraction in the bulk of the overlying gas during the spin coating is estimated.