Microstructure and Residual Stress of Metallic Thin Films According to Deposition Parameters

  • Park, Byung-Jun (Department of Materials Science and Engineering Chonnam National University) ;
  • Kim, Young-Man (Department of Materials Science and Engineering Chonnam National University)
  • 발행 : 2003.02.01

초록

In general, the microstructure in thin films was known to evolve in similar manner according to the energy striking the condensing film at similar homologous temperature, Th for the materials of the same crystal structure. The fundamental factors affecting particle energy are a function of processing parameters such as working pressure, bias voltage, target/sputtering gas mass ratio, cathode shape, and substrate orientation. In this study, Al, Cu, Pt films of the same crystal structure of face centered cubic (FCC) have been prepared under various processing parameters. The influence of processing variables on the microstructures and residual stress states in the films has been studied.

키워드

참고문헌

  1. H. Windischmann, Critical reviews in solid state and materials science, 17 (1992) 547 https://doi.org/10.1080/10408439208244586
  2. Y. G. Shen, Y. Wai, Q. C. Zhang, D. R. Mckenzie, W. D. McFall, W. E. Mcbride, J. Appl. Phys., 87 (2000) 177 https://doi.org/10.1063/1.371841
  3. A. Rizzo, M. A. Tagliente, M. Alvisi,. S. Scaglione, Thin Solid Films, 396 (2001) 29 https://doi.org/10.1016/S0040-6090(01)01242-1
  4. T. G. Chung, Y. H. Kim, J. G. Na, J. of the Korean Inst. of Met. & Mater, 29 (1991) 1127
  5. J. A. Thornton, J. Vac. Sci. Technol, All (1974)
  6. C. V. Thompson, Annual Rev. Mater. Sci., 30 (2000) 182
  7. R. F. Bunshah, G. E. McGuire, Handbook of plasma processing technology, Noyes Publications, New Jersey (1990) 483
  8. D. M. Mattox, Handbook of physical vapor deposition (PVD) Processing, Noyes Publications, New Jersey (1998) 444
  9. W. D. Nix, B. M. Clemens, J. Mater. Res., 14 (1999) 3467 https://doi.org/10.1557/JMR.1999.0468
  10. J. C. Park, S. G. Kim, S. J. Kim, J. of the Korean Inst. of Met. & Mater., 30 (1992) 231
  11. J. A. Thornton, D. W. Hoffman, J. Vac. Sci Technol., A, 3 (1985) 579
  12. E. Chason, B. W. Sheldon, L. B. Freund Phys. Rev. Let., 88 (2002) 2
  13. A. K. Sinha, T. T. Sheng, Thin Solid Films, 48 (1978) 125
  14. P. A. Flinn, D. S. Gardener, W. D. Nix, IEEE Trans. Electron Dev., ED-43 (1987) 694
  15. J. Proost, A. Wotvrpiw. P. Cosemans, Ph Roussel, K. Maex, Microelectronic Engineering, 33 (1997) 140