Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
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Microstructure and Residual Stress of Metallic Thin Films According to Deposition Parameters

  • Park, Byung-Jun (Department of Materials Science and Engineering Chonnam National University) ;
  • Kim, Young-Man (Department of Materials Science and Engineering Chonnam National University)
  • Published : 2003.02.01
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Abstract

In general, the microstructure in thin films was known to evolve in similar manner according to the energy striking the condensing film at similar homologous temperature, Th for the materials of the same crystal structure. The fundamental factors affecting particle energy are a function of processing parameters such as working pressure, bias voltage, target/sputtering gas mass ratio, cathode shape, and substrate orientation. In this study, Al, Cu, Pt films of the same crystal structure of face centered cubic (FCC) have been prepared under various processing parameters. The influence of processing variables on the microstructures and residual stress states in the films has been studied.

Keywords

References

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