마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제10권3호
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- Pages.9-17
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- 2003
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Effects of Silica Filler and Diluent on Material Properties of Non-Conductive Pastes and Thermal Cycling Reliability of Flip Chip Assembly
- Jang, Kyung-Woon (Dept. of Materials Science and Engineering, KAIST) ;
- Kwon, Woon-Seong (Dept. of Materials Science and Engineering, KAIST) ;
- Yim, Myung-Jin (ACA/F Dept., Telephus, Inc) ;
- Paik, Kyung-Wook (Dept. of Materials Science and Engineering, KAIST)
- 발행 : 2003.09.01
초록
In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature (