참고문헌
- ASC 2002 Improving the critical current density in Bi-2223 wires via a reduction of the scondary phase content Y.B.Huang;X.Y.Cai;T.Holesinger;V.A.Maroni;D.Yu;R.Parrella;M.Rupich;E.Hellstrom;M.Teplitsky;K.Venkataraman;D.Larbalestier
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Jpn. J. Appl. Phys.
v.36
Persistent mode operation of
$Bi_{2}Sr_{2}CA_{1}Cu_{2}O_{x}$ /Ag stacked double pancake coils with superconducting joints K.Fukushima;M.Okada;J.Sato;T.Kiyoshi;H.Kumakura;K.Togano;H.Wada https://doi.org/10.1143/JJAP.36.L1433 - 전기전자재료학회논문지 v.13 no.3 Bi-2223 초전도선재의 상전도-및 초전도-접합부 특성평가 김정호;지봉기;박형상;임준형;오승진;주진호;황보훈;나완수
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IEEE Trans. Appl. Supercon.
v.3
Superconducting joints formed between power-in-tube
$Bi_{2}Sr_{2}Ca_{2}Cu_{3}O_{z}$ /Ag tapes J.E.Tkaczyk;R.H.Arendt;P.J.Bednarcxyk;M.F.Garbauskas;B.A.Jones;R.J.Kilmer;K.W.Lay https://doi.org/10.1109/77.233852 - Cryogenics v.36 no.21 Fabrication of superconductively jointed silver-sheathed Bi-2212 tape T.Hase;K.Shibutani;S.Hayashi;M.Himada;R.Ogawa https://doi.org/10.1016/0011-2275(96)80765-X
- Cryogenics v.42 Development of Bi-2223 HTS tape and its application to coil and current leads S.S.Oh;H.S.Ha;D.W.Ha;H.M.Jang;C.Park;K.J.Song;:Y.K.Kwon;K.S.Ryu https://doi.org/10.1016/S0011-2275(02)00055-3
- Physica C v.372-376 Measurement of joint properties of Bi(Pb)-Sr-Ca-Cu-O (2223) tapes by field decay technique J.H.Kim;K.T.Kim;J.Joo;W.Nah https://doi.org/10.1016/S0921-4534(02)00931-0
- Supercond. Sci. Technol. v.15 Fabrication and characterization of the joining of Bi-Pb-Sr-Ca-Cu-O superconductor tape J.H.Kim;J.Joo https://doi.org/10.1088/0953-2048/15/11/320
- Supercond. Sci. Technol. v.10 Relation between critical current and exponent n in Bi(2223)/Ag tapes P.Kovac;L.Cesnak;T.Melisek;I.Husek;K.Frohlich https://doi.org/10.1088/0953-2048/10/8/014
- 전기전자재료학회논문지 v.14 no.6 Bi(2223) 다심 초전도 선재의 접합공정 연구 김정호;김규태;주진호;나완수
- 한국전기전자재료학회 2001년도 춘계학술대회논문집 고온 초전도 선재의 접합공정 연구 김정호;김규태;주진호;나완수;하홍수;오상수
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IEEE Trans. Appl. Supercond.
v.30
no.4
Effect of controlled carbon impurities on
J_{c} in Ag/Bi(2223) tapes A.Jeremie;R.Flukiger - Physica C v.372-376 Bubbling in the fabrication of Bi-2223/Ag wires using PIT process H.S.Ha;S.S.Oh;D.W.Ha;K.J.Song;Y.K.Kwon;K.S.Ryu https://doi.org/10.1016/S0921-4534(02)00943-7