Damping Properties and Transmlission Loss of Polyurethane. II. PU Layer and Copolymer Effect

  • Yoon, kwan-Han (School of Advanced Materials and System Engineering, Kumoh National Institute of Technology) ;
  • Kim, Ji-Gon (School of Advanced Materials and System Engineering, Kumoh National Institute of Technology) ;
  • Bang, Dae-Suk (School of Advanced Materials and System Engineering, Kumoh National Institute of Technology)
  • Published : 2003.06.01

Abstract

Polyurethane (PU) layer and copolymer consisted of the different molecular weights (1000 and 2000 g/mol) of poly(propylene glycol) (PPG) were prepared. The damping and mechanical properties of these materials were compared with PU 1000 made by PPG having the molecular weight of 1000 g/mol. The optimum composition of PU2000 used for PU layer and copolymer was diphenylmethane diioscynate (MDI)/propylene glycol (PPG)/butanediol (BD) (1/0.3/0.7) based on the damping and mechanical properties. The damping peak of PU copolymer was higher than those of PU layer and PUI 1000 in low temperature range (-30- $10^{\circ}C$). For application in noise reduction, the transmission loss of the mechanical vibration through solid structure was measured. PU layer and copolymer were used as a damping layer. The transmission loss of PU copolymer was more effective than those of PU layer and PU 1000 in the experimental frequency range.

Keywords

References

  1. L. H. Sperling, 'Introduction to Physical Polymer Science', 2nd ed., pp.303-381, Wiley-Interscience, New York, 1986
  2. J. D. Ferry in 'Viscoelastic Properties of Polymers', 3rd ed., pp.33-46, John Wiley & Sons, New York, 1980
  3. B. Hartman in 'Encyclopedia of Polymer Science and Engineering', 2nd ed., Vol. 1, pp.131-160, Wiley-Interscience, New York, 1984
  4. Y. Imai and T. Asano, J. Appl. Polym. Sci., 27, 183 (1982) https://doi.org/10.1002/app.1982.070270120
  5. H. Kothandararman, K. Venkatarao, and B. C. Thanoo, Polymer J., 21, 829 (1989) https://doi.org/10.1295/polymj.21.829
  6. P. K. Saxena, S. R. Srinivasan, J. Hrouz, and M. Ilavsky, J. Appl. Polym. Sci., 44, 1343 (1992) https://doi.org/10.1002/app.1992.070440804
  7. H. Weibo and Z. Fengchang, J. Appl. Polym. Sci., 50, 277 (1993) https://doi.org/10.1002/app.1993.070500209
  8. G. Spathis, M. Niaounakis, E. Konton, C. Apekis, P. Pissis, and C. Christodoulides, J. Appl. Polym. Sci., 54, 831 (1994) https://doi.org/10.1002/app.1994.070540701
  9. Y. C. Chern, S. M. Tseng, and K. H. Hsieh, J. Appl. Polym. Sci., 74, 328 (1999) https://doi.org/10.1002/(SICI)1097-4628(19991010)74:2<328::AID-APP14>3.0.CO;2-W
  10. D. J. Hourston and F. U. Schafer, Polymers for Advanced Technologies, 7, 273 (1995) https://doi.org/10.1002/(SICI)1099-1581(199604)7:4<273::AID-PAT520>3.0.CO;2-Q
  11. K. H. Yoon, S. T. Yoon, and O. O. Park, J. Appl. Polym. Sci., 75, 604 (2000) https://doi.org/10.1002/(SICI)1097-4628(20000131)75:5<604::AID-APP2>3.0.CO;2-#
  12. Z. S. Petrovic, M. Ilavsky, K. Dusek, M. Vidakovic, I. Javni, and B. Banjamin, J. Appl. Polym. Sci., 42, 391 (1991) https://doi.org/10.1002/app.1991.070420211
  13. H. Oberst, Acustica, Akust. Beih., 2, 181 (1952)