Journal of the Institute of Electronics Engineers of Korea TC (대한전자공학회논문지TC)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Optimization of Coaxial to Microstrip Transition

동축커넥터와 마이크로스트립의 전이구조 최적화

  • Published : 2003.02.01
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Abstract

In this paper, analysis and measurement on coaxial connecter designed for packaging of microwave and micro strip transition structure are carried out. Even though researches on optimization of various kinds of transition structures have been conducted actively; however, the range of the application was very limited since they have been focused mainly on improvement of specific transmission line. Therefore, in this paper, we tried to analyze three kinds of substrates of which dielectric constants are 2,5,10 and are commercially used nowadays. Besides, we have confirmed reliability of FEM analysis, extracted equivalent circuit of transition area, found out factors determining extracted physical values, and made proof of electromagnetic variations for optimum characteristics. In addition, transition structure showing optimized characteristics on the basis of dielectric and microstrip structure was proposed. We reckon that the result of this research will apply with effect to transition design in microwave packaging development.

본 논문에서는 초고주파 대역의 패키징을 위한 동축커넥터와 마이크로스트립의 전이 구조를 해석하고 측정하였다. 현재까지 여러 가지 전이구조의 최적화에 대한 연구는 활발히 이루어졌다. 하지만 주로 특정 전송 선로에 대해서만 개선되어져 왔기 때문에 그 적용범위가 매우 좁다. 따라서 본 논문에서는 상용화되고 있는 비유전율이 2, 5, 10인 세 종류의 기판을 모델로 해석하였다. 또한 FEM 해석의 신뢰성을 확인 후 전이부 분의 등가회로 모델을 추출하고, 추출된 물리적인 값들을 결정 하는 요인을 찾아내고 최적의 전이 특성을 위한 전자기적 변수들을 확인하였다. 더불어 기판 유전율과 마이크로스트림 구조를 기준으로 최적의 전이특성을 내는 전이구조를 제시하였다. 본 논문의 결과는 마이크로파 패키징 개발에서 동축커넥터와 마이크로스트립 최적의 전이구조 설계에 효과적으로 활용 될 수 있으리라 기대된다.

Keywords

References

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