ETRI Journal

  • 제25권4호
  • /
  • Pages.266-269
  • /
  • 2003
  • /
  • 1225-6463(pISSN)
  • /
  • 2233-7326(eISSN)
한국전자통신연구원 (Electronics and Telecommunications Research Institute)
권호 표지

Precision Molding of Polymeric Multi-Channel Optical Interconnection Devices Considering the Coefficient of Thermal Expansion of the Materials

  • 투고 : 2002.12.16
  • 발행 : 2003.06.30
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

Polymeric multi-channel optical interconnection devices that are usually fabricated by transfer molding are indispensable for parallel interconnection in high speed, high capacity optical communication systems. This paper proposes a design technique considering the thermal behavior of materials, such as shrinkage and expansion during the molding process, to satisfy geometrical requirements that have less than 1 ${\mu}m$ tolerance. We also designed molds considering the thermal effects of the materials and fabricated multi-channel optical fiber connectors that have less than 1 ${\mu}m$ tolerance.

키워드

참고문헌

  1. Proc. of OECC 8-channel Polymeric Optical Fiber Arrays for PLC Devices Packaging Ahn, S.H.;Han, S.P.;Choi, C.K.;Jeong, M.Y.;Choy, T.G.
  2. IEEE Trans. on CPMT v.21 no.4 Effective Material Properties and Thermal Stress Analysis of Epoxy Molding Compound in Electronic Packaging Shin, D.K.;Lee, J.J.
  3. Proc. of the 51st IEEE Electronic Components & Technology Conf. On the Performance of Epoxy Molding Compounds for Flip Chip Transfer Molding Encapsulation Rector, L.P.;Gong, S.;Gaffney, K.
  4. Effects of Tg and CTE on Semiconductor Encapsulants;Loctite Technical Paper Konarski, M.M.
  5. Proc. of ECTC Thermal and Viscoelastic Characterization of Transfer-Molded Epoxy Encapsulant During Simulated Post-Mold Cure Chew, S.