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기판의 열확산에 의한 3차원 공랭모듈로부터의 열전달촉진에 관한 연구

Enhancement of Heat Transfer from an Air-Cooled 3-Dimensional Module by means of Heat Spreading in the Board

  • 박상희 (금오공과대학교 기계공학부) ;
  • 홍택 (금오공과대학교 대학원 기계공학과)
  • 발행 : 2002.07.01

초록

The experiments were performed with a $31{\times}31{\times}7mm^3$ simulated 3-dimensional module on the thermal conductive board of a parallel plate channel. The convective thermal conductance for the path from the module surface directly to airflow and conjugate thermal conductance for the path leading from the module to the floor by way of a module support, then, to the airflow were determined with several combinations of module-support-construction(210, 0.32, 0.021 K/W)/floor-material(398, 0.236W/mK) and channel height(15-30mm). As the result, it was found that the conjugate thermal conductance and the temperature distribution around the module depend on the thermal resistance of the module support, and the channel height. These configurations were designed to investigate on the feasibility of using the substrate as an effective heat spreader in the forced convective air-cooling of surface mounted heat source. The experimental results were discussed in the light of interactive nature of heat transfer through two paths, one directed from the module to the airflow and the other via the module support and the floor to the air.

키워드

참고문헌

  1. Chang, M. J., Shyu, R. J. and Fang, L.J., 1987, 'An Experimental Study of Heat Transfer from Surface Mounted Components to a Channel Airflow,' ASME Paper No. 97-HT-75
  2. Roeller, P.T., Stevens, J., and Webb, B.W., 1991, 'Heat Transfer and Turbulent Flow Characteristics of Isolated Three-Dimensional Protrusions in Channels,' ASME J. of Heat Transfer, Vol. 113, pp. 597-603 https://doi.org/10.1115/1.2910607
  3. Rosten, H. I., and Viswanath, R., 1994, 'Thermal Modeling of the Pentium TM Processor Package,' IEEE Electronic Component Technology Conf., Washington, D.C., pp. 421-428
  4. Behnia, M., Nakayama, W. and Wang, J.,1998, 'CFD Simulation of Heat Transfer from a Heated Module in an Air Stream: Comparison with Experiments and a Parametric Study,' InterSociety Conf. on Thermal Phenomena, pp. 143-151 https://doi.org/10.1109/ITHERM.1998.689532
  5. Nakamura, H., Igarashi, T. and Tsutsui, T., 2001, 'Local Heat Transfer Around a WallMounted Cube in the Turbulent Boundary Layer,' Int. J. of Heat Mass Transfer, Vol. 44, pp. 3385-3395 https://doi.org/10.1016/S0017-9310(01)00009-6
  6. Graham, K. and Witzman, S., 1988, 'Analytical Correlation of Thermal Design of Electronic Packages,' Cooling Technology for Electronic Equipment, pp. 249-264
  7. Ramadhyani, S., Moffat, D. F. and Incropera, F. P., 1985, 'Conjugate Heat Transfer from Small Isothennal Heat Sources Embedded in a Large Substrate,' Int. J. of Heat Mass Transfer, Vol. 28, No. 10, pp. 1945-1952 https://doi.org/10.1016/0017-9310(85)90216-9
  8. Moffat, D. F., Rarnadhyani, S. and lncropera, F. P., 1986, 'Conjugate Heat Yransfer from Wall Embedded Sources in a Rectangular Channel,' ASME HTD-57, pp. 177-182
  9. Ortega, A., Ramanathan, S., Chicci, J. D. and Prince, J. L., 1993, 'Thermal Wake Models for Forced Air Cooling of Electronic Components,' Proc. 9th IEEE SEMI-THERM Symposium, pp. 63-74 https://doi.org/10.1109/STHERM.1993.225330
  10. Davalath, J, and Bayazitoglu, T., 1987, 'Forced Convection Cooling Across Rectangular Blocks,' ASME J. of Heat Transfer, Vol. 109, pp. 321-328 https://doi.org/10.1115/1.3248083
  11. Nakayama, W. and Park, S. H., 1996, 'Conjugate Heat Transfer form a Single Surface-Mounted Blick to Forced Convective Air Flow in a Channel,' ASME J. of Heat Transfer, Vol. 118, pp. 301-309 https://doi.org/10.1115/1.2825845
  12. Zhang, X., Imamura, T. and Fujii M., 1999, Conjugate Heat Transfer from Small Heat Source Mounted on a Conductive Wall,' ASME Advances in Electronic Packaging, EEP-Vol. 26-1, pp. 511-519
  13. Lee, J. H., Park, S. H., Riu, K. J. and Bang, C. H., 2000, 'Mixed Convection Transport from a Module on the Bottom Surface of Three Dimensional Channel,' Trans. of the KSME, Vol. 24, No.5, Part B, pp. 632 -639
  14. Yun, B. T. and Choi, D. H., 1999, 'Analysis of Three-Dimensional Mixed Convection Flow About Uniformly Distributed Heat-Generating Blocks on a Conductive Wall,' Trans. of the KSME, Part B, Vol. 23, No. 1, pp. 1-11
  15. Cengel, Y. A., 1998, Heat Transfer 1st ed. Hntemational Edition
  16. Kline, S. J., 1985, 'The Purposes of Uncertainty Analysis,' ASME J. of Fluid Engineering, Vol. 107, pp. 153-160 https://doi.org/10.1115/1.3242449