대한기계학회논문집B (Transactions of the Korean Society of Mechanical Engineers B)

  • 제26권7호
  • /
  • Pages.1022-1030
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  • 2002
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  • 1226-4881(pISSN)
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  • 2288-5324(eISSN)
대한기계학회 (The Korean Society of Mechanical Engineers)
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기판의 열확산에 의한 3차원 공랭모듈로부터의 열전달촉진에 관한 연구

Enhancement of Heat Transfer from an Air-Cooled 3-Dimensional Module by means of Heat Spreading in the Board

  • 박상희 (금오공과대학교 기계공학부) ;
  • 홍택 (금오공과대학교 대학원 기계공학과)
  • 발행 : 2002.07.01
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초록

The experiments were performed with a $31{\times}31{\times}7mm^3$ simulated 3-dimensional module on the thermal conductive board of a parallel plate channel. The convective thermal conductance for the path from the module surface directly to airflow and conjugate thermal conductance for the path leading from the module to the floor by way of a module support, then, to the airflow were determined with several combinations of module-support-construction(210, 0.32, 0.021 K/W)/floor-material(398, 0.236W/mK) and channel height(15-30mm). As the result, it was found that the conjugate thermal conductance and the temperature distribution around the module depend on the thermal resistance of the module support, and the channel height. These configurations were designed to investigate on the feasibility of using the substrate as an effective heat spreader in the forced convective air-cooling of surface mounted heat source. The experimental results were discussed in the light of interactive nature of heat transfer through two paths, one directed from the module to the airflow and the other via the module support and the floor to the air.

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참고문헌

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