Study on Heat Resistance Anaerobic Adhesive Which Expands When Post Cured

  • Zhai, Haichao (Beijing Tianshan New Materials and Technology Company) ;
  • Li, Yinbai (Beijing Tianshan New Materials and Technology Company) ;
  • Lin, Xinsong (Beijing Tianshan New Materials and Technology Company)
  • Received : 2001.11.23
  • Accepted : 2002.01.21
  • Published : 2002.03.21

Abstract

In this paper, N,N-m-phenyenedimaleimide (m-PDM), Polyamide Resin (PI) and Metallic dimethacrylate etc. influencing the heat resistance of anaerobic adhesive has been studied, an anaerobic adhesive composition capable of post-cure expansion and $230^{\circ}C$ temperature resistance comprising a multifunctional methacrylate and m-PDM capable of effectuating expansion upon post-cure has been developed. A homogeneous mixture of a monomer and m-PDM are subjected to a first cure heat stage (Room Temperature) wherein a rigid partially-cured plastic is formed and a post-cure heat stage ($150^{\circ}C$) to effectuate permanent expansion of cured adhesive composition.

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