Transactions of Materials Processing (소성∙가공)

The Korean Society for Technology of Plasticity and materials processing (한국소성∙가공학회)
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Development of Ultrasonic Bonding Process for Micro Components

미세 부품의 초음파 접합공정 개발

  • Published : 2002.11.01
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Abstract

The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.

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References

  1. Semiconductor wafer bonding Tan, Q-Y.;Gosele, U.
  2. Fundaentals of microfabrication Madou, M.
  3. IEEE Trans. On advanced packaging v.23 no.4 MEMS post-packaging by localized heating and bonding LIn, L. https://doi.org/10.1109/6040.883749
  4. IEEE Trans. on components, packaging and manufacturing tech. v.21 no.1 Thermosonic flip chip bonding using longitudinal ultrasonic vibration Tan, Q. https://doi.org/10.1109/96.659506

Cited by

  1. One-wavelength Ultrasonic Horn Design for Ultrasonic Machining of Mobile Phone Battery Terminal Welding vol.21, pp.1, 2012, https://doi.org/10.7735/ksmte.2012.21.1.070