Leakage Current Mechanism of Thin-Film Diode for Active-Matrix Liquid Crystal Displays

  • Lee, Myung-Jae (Dept. of Electronics Engineering, Kyung-Hee University) ;
  • Chung, Kwan-Soo (Dept. of Electronics Engineering, Kyung-Hee University) ;
  • Kim, Dong-Sik (Dept. of Computer Engineering, Inha Technical College)
  • Published : 2002.09.01

Abstract

The origin of image-sticking in metal-insulator-metal type thin-film diode liquid crystal displays(TFD-LCDs) is the asymmetric current-voltage(I-V) characteristic of TFD element. We developed that TFD-LCDs have reduced-image-sticking. Tantalum pentoxide(Ta$_2$O$\sub$5/) is a candidate for use in metal-insulator-metal(MIM) capacitors in switching devices for active-matrix liquid crystal displays(AM-LCDs). High quality Ta$_2$O$\sub$5/ thin films have been obtained from anodizing method. We fabricated a TFD element using Ta$_2$O$\sub$5/ films which had perfect current-voltage symmetry characteristics. We applied novel process technologies which were postannealed whole TFD element instead of conventional annealing to the fabrication. One-Time Post-Annealing(OPTA) heat treatment process was introduced to reduce the asymmetry and shift of the I-V characteristics, respectively. OPTA means that the whole layers of lower metal, insulator, and upper metal are annealed at one time. Futhermore, in this paper, we discussed the effects of top-electrode metals and annealing conditions.

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