Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Modeling of Self-Aligning Effect in Flip Chip Soldering

플립칩 솔더링의 자기정렬 효과에 관한 모델링

  • 정용진 (한국과학기술원 기계공학과) ;
  • 안도현 (한국과학기술원 기계공학과) ;
  • 유중돈 (한국과학기술원 기계공학과) ;
  • 김용석 (홍익대학교 재료공학과)
  • Published : 2002.12.01
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Abstract

The self-aligning effect is useful in the electronic packaging because it compensates the positional errors occurred in flip chip placement. The solder shapes are predicted in this work either by minimizing the energy of the solder profile using the second-order polynomials or by the Surface Evolver program. The restoring forces and spring constants in vertical and horizontal directions are calculated to estimate the self-aligning effect. The calculated results using the second-order polynomial are similar to those using the Surface Evolver in the vertical direction. However, significant discrepancy between the results using the polynomial and Surface Evolver occurs in the horizontal direction. The assumption of the circular cross-section of the solder joint appears to cause the discrepancy. As the horizontal restoring force and spring constant are smaller than those in the vertical direction, larger aligning error can be resulted in the horizontal direction.

Keywords

References

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