광통신송수신 모듈 패키징 기술

  • 고재상 (한국전자통신연구원 광통신부품연구센터)
  • 발행 : 2002.05.01

초록

키워드

참고문헌

  1. Optoelectronics Packaging Workshop Equipment Deve-lopments and Issues for Assembly Bruce W. Hueners
  2. J. Lightwave Tech v.12 Packaging Technology for a 10-Gb/s Photoreceiver Module Y. Oikawa;H. Kuwatsuka;T. Yama-moto;T. Ihara;H. Hamano;T. Minami
  3. Microelectronics packaging handbook Rao R. Tummala;Eugene J. Ryma-szwski
  4. Global technical and commercial developments with flip chip technology, 1996 ECTC Carles L. Lassen
  5. Optoelec-tronics Packaging ALAN R. MICKELSON