광통신송수신 모듈 패키징 기술

참고문헌

1. Optoelectronics Packaging Workshop Equipment Deve-lopments and Issues for Assembly Bruce W. Hueners
2. J. Lightwave Tech v.12 Packaging Technology for a 10-Gb/s Photoreceiver Module Y. Oikawa;H. Kuwatsuka;T. Yama-moto;T. Ihara;H. Hamano;T. Minami
3. Microelectronics packaging handbook Rao R. Tummala;Eugene J. Ryma-szwski
4. Global technical and commercial developments with flip chip technology, 1996 ECTC Carles L. Lassen
5. Optoelec-tronics Packaging ALAN R. MICKELSON