전자공학회지 (The Magazine of the IEIE)

대한전자공학회 (The Institute of Electronics and Information Engineers)
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시스템 냉각기술 동향

  • 발행 : 2002.05.01
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참고문헌

  1. J. of Electronic Packaging v.114 State-of-the Art and Trends in the Thermal Packaging of Electronic Equipment Bar-Cohen, A.
  2. 공기조화냉동공학논문집 v.10 no.2 고발열 전자부품 냉각용 써모사이폰의 냉각특성에 관한 연구 김광수;김원태;송규섭;이기백
  3. Proceedings of 4th International Symposium on Microelectronics and Packaging Development of Thermosyphon for Cooling of High Power Electronic Components in Telecommunication Sys-tem Kim, K. S;Park, J. M;Song, K. S
  4. Technical Note v.9 Cooling of CPU Using Micro Heat Pipe Eguchi, K.;Mochizuki, M.;Mashiko, K.;Goto, K.;Saito, Y.;Nagaki, Y.;Takamiya, A.;Nguyen, T.
  5. 11th Int. Heat Pipe Conf v.1 Cooling Characterics of Miniature Heat Pipes with Woven-Wired Wick Kim, K. S.;Moon, S. H.;Choi, C. G.
  6. Handbook of Electron-ic Packaging Design Michael Pecht
  8. Proceedings of the 6th Int. Heat Pipe Symposium Cooling Performance of a Heat Sink with Embedded Heat Pipes Kim, K.S.;Won, M.H.;Son, K.H.;Kim, H.B.;Han, J.S.