한국광학회지 (Korean Journal of Optics and Photonics)

  • 제13권3호
  • /
  • Pages.223-227
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  • 2002
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  • 1225-6285(pISSN)
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  • 2287-321X(eISSN)
한국광학회 (Optical Society of Korea)
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Hot Embossing기술을 이용한 병렬 광접속용 고분자 광도파로 제작

Fabrication of polymeric optical waveguides for parallel optical interconnection using hot embossing technique

  • 최춘기 (한국전자통신연구원 반도체·원천기술연구소 광접속모듈팀) ;
  • 김병철 (한국전자통신연구원 반도체·원천기술연구소 광접속모듈팀) ;
  • 한상필 (한국전자통신연구원 반도체·원천기술연구소 광접속모듈팀) ;
  • 안승호 (한국전자통신연구원 반도체·원천기술연구소 광접속모듈팀) ;
  • 정명영 (한국전자통신연구원 반도체·원천기술연구소 광접속모듈팀)
  • 투고 : 2002.02.14
  • 발행 : 2002.06.01
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초록

병렬 광접속용 다중모드 고분자 광도파로를 제작하였으며, 도파로 구조는 LIGA 공정에 의해 제작된 니켈 성형 마스터에 의해 hot embossing기술을 이용하여 성형하였다. 도파로 크기가 48$\times$47$\mu\textrm{m}$$^{2}$인 다중모드 광도파로를 단순 2단계 공정에 의해 제작하였으며, 0.85$\mu\textrm{m}$과 1.3$\mu\textrm{m}$ 파장대역에서 측정한 다중모드 광도파로의 도파손실은 각각 0.38dB/cm와 0.66dB/cm이었다.

Polymeric multi-mode optical waveguides were fabricated for parallel optical interconnection. Waveguide structures were molded by a Ni mold master using a hot embossing technique. The Ni mold master was manufactured by LIGA process. Multimode optical waveguides with a 48$\times$47 ${\mu}{\textrm}{m}$$^2$cross-section were produced by a simple two-step process. The propagation losses of the multimode waveguide measured at 0.85 ${\mu}{\textrm}{m}$ and 1.3 ${\mu}{\textrm}{m}$ wavelengths were 0.38 dB/cm and 0.66 dB/cm, respectively.

키워드

참고문헌

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