마이크로전자및패키징학회지 (Journal of the Microelectronics and Packaging Society)
- 제9권1호
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- Pages.21-28
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- 2002
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- 1226-9360(pISSN)
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- 2287-7525(eISSN)
Bi, In을 함유한 Sn-Cu-Ni계 솔더 합금 제조와 물성
The Properties and Processing of Bismuth and Indium Added Sn-Cu-Ni Solder Alloy System
초록
Sn-Cu-Ni계 솔더 합금에 소량의 Bi와 In을 첨가하여 새로운 무연솔더 합금 개발을 진행하였다. Sn-0.7%(Cu+Ni)에 2~5% Bi. 2~10% In을 첨가하여 각각의 열적, 전기적, 기계적 특성을 평가하였다. 솔더합금의 융점은 200~
Bismuth and Indium added Sn-Cu-Ni solder alloy was investigated for a new lead free solder. The thermal, electrical and mechanical properties were characterized for the Sn-0.7%(Cu+Ni) solder alloy by adding 2~5% Bi and 2~ 10% In. The melting point of solder alloy was in range of 200 to