전자선 경화를 이용한 에폭시 수지의 열안정성과 경화동력학에 관한 연구

Studies on Thermal Stability and Cure Behavior of Epoxy Resins using Electron-beam Curing Technique

  • 박수진 (한국화학연구원 화학소재연구부) ;
  • 허건영 (한국화학연구원 화학소재연구부) ;
  • 이재락 (한국화학연구원 화학소재연구부)
  • 발행 : 2002.04.01

초록

이관능성 에폭시 수지인 DGEBA와 DGEBF를 양이온 촉매인 BQH를 사용하여 전자선(electron-beam) 경화 기술에 의해 경화하였다. 그리고 수지의 구조적 차이가 열안정성과 경화동력학에 미치는 영향을 연구하였다. 실험적 결과에 의하면, Horowitz-Metzger 법에 의한 분해 활성화 에너지는 DGEBA의 경우가 높았지만 적분 열분해 온도(IPDT)는 DGEBA가 DGEBF 보다 낮았다. 이것은 DGEBF 주사슬의 수소 결합으로 인해 가교밀도가 높아졌기 때문인 것으로 사료되며, 근적외선 분광기(NIRS)를 사용하여 $5235\;cm^{-1}$$7000\;cm^{-1}$에서의 hydroxyl band의 증가로 확인하였다.

The di-functional epoxy resins, i.e., diglycidylether of bisphenol A(DGEBA) and diglycidylethere of bisphenol F(DGEBF) were initiated by cationic catalyst, i.e., benzylquinoxalinium hexafluoroantimonate(BQH) using electron-beam(EB) technique. And the effect of structure of DGEBA and DGEBF on thermal stabilities and cure behaviors was investigated. According to the experimental results, the decomposed activation energy based on Horowitz-Metzger method was higher in the case of DGEBA, but intergral procedural decomposition temperature(IPDT) of DGEBA was lower than DGEBF. This could be interpreted in terms of high crosslink density resulted from hydroxyl bond of DGEBF backbone. It was confirmed in increasing the hydroxyl band at $7000\;cm^{-1}$ and $5235\;cm^{-1}$ using near-infrared spectroscopy(NIRS).

키워드

참고문헌

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