Journal of the Korean Electrochemical Society (전기화학회지)

The Korean Electrochemical Society (한국전기화학회)
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Effect of NH4Cl on the Electrodeposition of Cobalt/Phosphorus Alloy

CoP합금의 전기도금 시 NH4Cl의 영향에 관한 연구

  • Lee, Kwan-Hyi (Metal Processing Research Center, Korea Institute of Science and Technology) ;
  • Jeung, Won-Young (Metal Processing Research Center, Korea Institute of Science and Technology)
  • 이관희 (한국과학기술연구원 금속공정연구센터) ;
  • 정원용 (한국과학기술연구원 금속공정연구센터)
  • Published : 2002.05.01
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Abstract

In this study, the effect of ammonium chloride on the electrodeposition of CoP magnetic alloy film was investigated. The correlation between the electrodeposition condition and the magnetic properties was tried to elucidate by the electro- analytical tests such as cyclic voltammetry. It was observed that the magnetic properties of the films were varied extensively with the ammonium chloride contents in the solution. The reason why the magnetic properties of the films were varied with the addition of ammonium chloride was thought that the addition of ammonium chloride controlled the electrocrystallization of CoP kinetically by charge transfer and increased the grain size and the orientation factor. This may cause the variation of the magnetic properties of CoP films.

본 연구에서는 염화암모늄을 함유한 전해질에서 CoP 자성합금 박막을 전기도금 방식으로 제조하고 염화암모늄의 첨가량이 다른 용액에서의 CV 등 전기화학적인 분석을 통해 핵생성과 결정화(electrocrystallization)에 미치는 영향을 고찰하여 자기적 성질과의 상호관계를 밝히고자 하였다. 용액 중에 첨가된 염화암모늄은 첨가량이 많을수록 분극도를 감소시키고, charge transfer에 의해 electrocrystallization과정을 속도론적으로 제어함으로써 결정립의 크기가 커지고 orientation factor가 증가된다. 이러한 구조적, 결정학적 변화가 CoP 도금층의 자기적 성질을 변화시킴을 관찰하였다.

Keywords

References

  1. A. S. Frieze, R. Sard and R. Weil, J. Electrochem. Soc., 115, 586(1968) https://doi.org/10.1149/1.2411348
  2. R. D. Fisher, W. H. Chilton, J. Electrochem. Soc., 109, 485 (1962) https://doi.org/10.1149/1.2425452
  3. M. Schlesinger and J. Kisel, J. Electrochem. Soc., 131, 1658 (1989)
  4. R. O. Cortijo and M. Schlesinger, J. Electrochem. Soc., 126, 2800 (1984)
  5. M. Mirzamaani, L. Romankiw, C. McGrath and J. Karasinski, J. Electrochem. Soc., 130, 2813 (1990)
  6. T. M. Liakopoulos, W. Zhang and C. H. Ahn, IEEE Trans. Magn., 32, 5154 (1996) https://doi.org/10.1109/20.539521
  7. H. J. Cho and C. H. Ahn, IEEE Trans. Magn., 36, 686 (2000)
  8. N. V. Myung, H. Yang, M. Schwartz, J. W. Judy, C. K. Yang and K. Nobe, meedng abstracts in 198th ECS meeting, 2000-2, 583 (2000)
  9. S. S. Djokic, J. Electrochem. Soc., 146, 1824 (1999) https://doi.org/10.1149/1.1391850
  10. R. C. DeMattei, A. Watcharapasom and R. S. Feigelson, J. Electrochem. Soc., 148, D109 (2001) https://doi.org/10.1149/1.1389342
  11. J. Sinnecker, M. Knobel, K. R. Pirota, J. M. Garcia, A. Asenjo, and M. Vazquez, J. Appl. Phys., 87, 4825 (2000) https://doi.org/10.1063/1.373172
  12. G. Barcelo, J. Garcia, M. Sarret and C. Muller, J. Appl. Electrochem., 24, 1249 (1994) https://doi.org/10.1007/BF00249889
  13. L. M. Baugh, Electrochimica Acta, 24, 669 (1979) https://doi.org/10.1016/0013-4686(79)87049-8
  14. A. B. Velichenko, J. Portillo, M. Sarret and C. Muller, Electrochim. Acta, 44, 3377 (1999) https://doi.org/10.1016/S0013-4686(99)00049-3
  15. C. Muller, M. Sarret and M. Benballa, Electrochim. Acta, 46, 2811 (2001) https://doi.org/10.1016/S0013-4686(01)00493-5
  16. C. A. Marozzi and A. C. Chialvo, Electrochim. Acta, 45, 2111 (2000) https://doi.org/10.1016/S0013-4686(99)00422-3
  17. M. Pourbaix, 'Atlas of Electrochemical Equilibria in aqueous solutions', Pergamon Press, 1st Eng. Ed., New York (1966)
  18. I. Rodiiguez-torres, G. Valentin and F. Lapicque, J. Appl. Electrochem., 29, 1035 (1999) https://doi.org/10.1023/A:1003610617785
  19. R. Fratesi and G. Roventi, J. Appl. Electrochem., 22, 657 (1992) https://doi.org/10.1007/BF01092615
  20. J. Ji, C. Cooper, D. B. Dieisinger and E. Peters, J. Appl. Electrochem., 25, 642 (1995)
  21. R. Pfiz and G. Strube, Trans. Inst. Metal Finish., 74, 158 (1996) https://doi.org/10.1080/00202967.1996.11871117
  22. US Patent 3,652,442 (1972) and 4,102,756 (1978)
  23. A. Brenner, 'Electrodeposition of Alloys', Vol. I, 78, Academic Press, New York (1963)
  24. J. W. Dini, Plat. Surf. Finish., 75, 11 (1988)
  25. S. Fletcher, C. S. Halliday, D. Gates, M. Westcott, T. Lwin and G. Nelson, J. Electronical. Chem., 159, 267 (1983) https://doi.org/10.1016/S0022-0728(83)80627-5
  26. J. Kor. Electrochem. Soc., 3, 152 (2000)
  27. K. H. Lee, H. Y. Lee and W. Y. Jeung, meedng abstracts in 198th ECS meeting, 2000-2, 638 (2000)