Trapping and Detrapping of Transport Carriers in Silicon Dioxide Under Optically Assisted Electron Injection

  • Kim, Hong-Seog (Division of Information communication Engineering Paichai University)
  • Published : 2001.09.01

Abstract

Based on uniform hot carrier injection (optically assisted electron injection) across the $Si-SiO_2$ interface into the gate insulator of n-channel IGFETs, the threshold voltage shifts associated with electron injection of $1.25{\times}l0^{16}{\;}e/\textrm{cm}^2 between 0.5 and 7 MV/cm were found to decrease from positive to negative values, indicating both a decrease in trap cross section ($E_{ox}{\geq}1.5 MV/cm$) and the generation of FPC $E_{ox}{\geq}5{\;}MV/cm$). It was also found that FNC and large cross section NETs were generated for $E_{ox}{\geq}5{\;}MV/cm$. Continuous, uniform low-field (1MV/cm) electron injection up to $l0^{19}{\;}e/\textrm{cm}^2 is accompanied by a monatomic increase in threshold voltage. It was found that the data could be modeled more effectively by assuming that most of the threshold voltage shift could be ascribed to generated bulk defects which are generated and filled, or more likely, generated in a charged state. The injection method and conditions used in terms of injection fluence, injection density, and temperature, can have a dramatic impact on what is measured, and may have important implications on accelerated lifetime measurements.

Keywords

References

  1. C. K. Williams, A. Reisman, P. Bhattacharya, and W. Ng, J. Apply. Phys., vol. 64, p. 1145, 1988 https://doi.org/10.1063/1.341876
  2. C. K. Williams, A. Reisman, and P. Bhattacharya, J. Apply. Phys., vol. 66, p. 379, 1989 https://doi.org/10.1063/1.343886
  3. M. Walters and A. Reisman, J. Apply. Phys., vol. 67, p. 2992, 1990 https://doi.org/10.1063/1.345421
  4. C. T. Gabriel, 2001 6th Intl. Symp. Plasma Process-Induced Damage, p. 20, 2001
  5. P. W. Mason, D. K. DeBusk, J. K. McDaniel, 2000 5th Intl. Symp. Plasma Process-Induced Damage, p. 2, 2000
  6. J. W. Jung, S. B. Han, and Kyungho Lee, J. Semiconductor Technology science vol 1, p. 31, 2001
  7. I. Chen, J. Y. Choi, T. Chan, and C. Hu, IEEE Trans. Electron Devices, vol. 35, p. 2253, 1988 https://doi.org/10.1109/16.8800
  8. R. Bright and A. Reisman, J. Electrochem. Soc., vol. 140, p. 2065, 1993 https://doi.org/10.1149/1.2220765
  9. Y. Nissan-Cohen, J. Shappir, and D. Frohman-Bentchkowsky, J. Apply. Phys., vol. 60, p. 2024, 1986 https://doi.org/10.1063/1.337204
  10. D. J. DiMaria and J. W. Stasiak, J. Apply. Phys., vol. 65, p. 2342, 1989 https://doi.org/10.1063/1.342824
  11. C. C. H. Hsu, T. Nishida, and C. T. Sah, J. Apply. Phys., vo. 63, p. 5882, 1988 https://doi.org/10.1063/1.340281
  12. B. Doyle, M. Bourcerie, J. ?C. Marchetaux, and A. Boudou, IEEE Trans. Electron Dev., vol. 37, p. 744, 1990 https://doi.org/10.1109/16.47781
  13. T. Nishida and S. E. Thompson, J. Apply. Phys., vol. 69, p. 3986, 1991 https://doi.org/10.1063/1.348914
  14. H. S. Kim, A. Reisman, and C. K. Williams, J. Electrochem. Soc., vol. 144, p. 2517, 1997 https://doi.org/10.1149/1.1837847
  15. A. Reisman, C. K. Williams, and J. R. Maldonado, J. Apply. Phys., vol. 62, p. 868 , 1987 https://doi.org/10.1063/1.339691
  16. T. H. Ning and H. N. Yu., J. Apply. Phys., vol. 45, p. 5373, 1974 https://doi.org/10.1063/1.1663246
  17. T. H. Ning J. Apply. Phys., vol. 49, p. 4077 , 1978 https://doi.org/10.1063/1.325368
  18. E. H. Nicollian, C. N. Berglund, P. F. Schmidt, and J. M. Andrews, J. Apply. Phys., vol. 42, p. 5654, 1971 https://doi.org/10.1063/1.1659996
  19. C. Hu, S. C. Tam, F. ?C. Hsu, P. ?K. Ko, T ?Y. Chen, and K. W. Terrill, IEEE Trans. Electron Dev., vol. 32, p. 375, 1985
  20. R. Bellens, E. de Schrijver, G. Van den bosch, G. Groeseneken, P. Hermans, and H. E. Maes, IEEE Trans. Electron Dev., vol. 41, p. 413, 1994 https://doi.org/10.1109/16.275228
  21. L. Lipkin, A. Reisman, and C. K. Williams, Apply. Phys. Lett., vol. 57, p. 2237, 1990 https://doi.org/10.1063/1.104162
  22. T. H. Ning J. Apply. Phys., vol. 47, p. 1079, 1976 https://doi.org/10.1063/1.322729
  23. D. J. DiMaria, E. Cartier, and D. Arnold, Appl. Phys. Lett., vol. 73, p. 3367, 1993 https://doi.org/10.1063/1.352936
  24. M. Walters and A. Reisman, J. Electrochem. Soc., vol. 38, p. 2576, 1991 https://doi.org/10.1149/1.2086050