Synthesis of Newel Positive Type Photosensitive Polyimide

  • Ahn, Byung-Hyun (Division of Materials Engineering, Pukyong National University) ;
  • Lee, Dae-Woo (Division of Chemical Engineering, Pusan National University) ;
  • Lee, Jin-Kook (Division of Chemical Engineering, Pusan National University)
  • 발행 : 2001.10.01

초록

Tricyclic aliphatic dianhydride monomer, tricycle[4.2.2.0]dec-9-ene exo, endo-3,4: 7,8-tetra-carboxylicdianhydride (TCDDA), was synthesized by photochemical reaction and poly(amic acid)s from TCDDA and diamines such as 1,4-bis-(4-aminophenoxy)benzene (BAB), 2,2-bis(4-(4-aminophenoxy) phenyl) propane (BAPP), 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane (BAPHF), bis(4-(4-ami-nophenoxy) phenyl)sulfone (BAPS), and 1,4-bis-(4-aminophenoxy)biphenyl (BABP) were prepared. The inherent viscosities of the poly(amic acid)s were between 0.39 and 0.50 dL/g. The poly(amic acid)s were converted to polyimide films by thermal imidization. The glass transition temperatures (T$\_$g/) of the polyimides were in the range of 201-263$\^{C}$. The thermogravimetric analysis (TGA) thermogram of these polyimides showed the temperatures of 5% weight losses between 375 and 393$\^{C}$ in nitrogen atmosphere. To show their utility for image generation, degradations of these polyimides in UV exposure were investigated by UV spectroscopy.

키워드

참고문헌

  1. Polyimides D. Willson, H.D.;Stengenberger;P.M. Hergenrother
  2. Polymides and Other High-Temperature Polymer, M. J.(ed);M. Abadie(ed);B. Sillion(ed)
  3. Mater. Res. Symp. Proc. v.167 no.87 H. Hiramoto
  4. Electronic Materials Handbook v.1 J. D. Craig;M. L. Hinges(ed)
  5. Thin Film Multichip Modules P. E. Garrou;G. Messner(ed);I. Turlik(ed);J. W. Balde(ed);P. E. Garrou(ed)
  6. Polymers for Electronic and Photonic Application D. J. Monk;D. Soane;C. P. Wong(ed)
  7. Polyimides: Synthesis, Characterization and Applications v.1&2 K. L. Mittal(ed)
  8. Proc. ISHM International Conference on Multichip Modules R. H. Heistand;D.C. Frye;D. C. Burdeaux;J. N. Carr
  9. Polym. Eng. Sci. v.2 no.426 R. E. Kerwin;M. R. Goldrick,
  10. Siemens Forsh. Entwickl. Ber. v.2 no.426 R. Rubner
  11. Siemens Forsh. Entwickl. Ber. v.4 no.235 R. Rubner;B. Barter;G. Bald
  12. Photogr. Sci. Eng. v.23 no.203 R. Rubner;H. Ahne;E. Kuhn;G. Kolodziej
  13. 4th International Conference on Polyimides T. Omote;T. Yamaoka
  14. Electrochem. Soc. v.138 no.1080 S. Kubota;Y. Tanaka;T. Morikawi;S. Eto
  15. Korean Polymer J. v.8 no.19 B. H. Ahn;D. W. Lee;J. K. Lee;S. S. Hong;G. D. Lee
  16. Organic Photochemical Symthesis v.2 E. Grovenstein, Jr.;D. V. Rao;J. W. Taylor;R. Srinvasan(ed);T. D. Robersts(ed)