Growth and characterization of BON thin films prepared by low frequency RF plasma enhanced MOCVD method

  • Chen, G.C. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Lim, D.-C. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Lee, S.-B. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Hong, B.Y. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Kim, Y.J. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University) ;
  • Boo, J.-H. (Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University)
  • 발행 : 2001.10.01

초록

It was first time that low frequency R.F. derived plasma enhanced MOCVD with frimethylborate precursor was used to fabricate a new ternary compound $BO_{x}$ $N_{y}$ . The formation of BON molecule was resulted from nitrogen nitrifying B-O, and forming the angular molecule structure proved by XPS and FT-IR results. The relationship between hardness and film thickness was studied. An thickness-independent hardness was fond about 10 GPa. The empirical calculation of band-gap and UV test result showed that our deposited $BO_{x}$ $N_{y}$ thin film was semiconductor material with 3.4eV of wide band gap. The electrical conductivity, $4.8$\times$10^{-2}$ /($\Omega$.cm)$^{-1}$ also confirmed that $BO_{x}$ $N_{y}$ has a semiconductor property. The roughness detected from the as-grown films showed that there was no serious bombarding effect due to anion in the plasma occurring in the RF frequency derived plasma.

키워드