참고문헌
- IEEEP roceedings of the 49th Electronic Components & Technology Conference Estimate the Thermomechanical Fatigue Life of Two Chip Scale Pachages Q. Yao;J. Qu;S.X. Wu
- Microelctronics Reliability v.39 Characterization of chip scalepachaging materials M. Amagai
- Transactions of the ASME v.121 Three-Dimensional Versus Two Dimensional finite Element Modeling Finite Element Modeling of Flip-Chip Pachages Q. Yao;J. Qu
- Influence of Process Variables on the Reliability of Micro BGA Package Assemblies J. Partridge;P. Boysan
- 대한용접학회 논문집 v.17 플라스틱 IC 패키지 접합부의 수명예측 및 품질 향상에 관한 연구 신영의;김종민
- 대한용접학회 논문집 v.17 no.6 패키지 유형에 따른 솔더 접합부의 열피로에 관한 연구 신영의;김경섭
- Mate v.98 Shear Fatigur Characteristics of Sn-Ag-Bi, Sn-Ag-Cu and Sn-Ag-In Solder Joint Y. Oguchi;Y. Kariya;M. Otsuka
- Mate v.98 Effect on Strain Rate, Hold Time and Third Element on the Fatigue Y. Kariya;H. Kagawa;M. Otsuka
- Transactions of the ASME v.76 A study of the Effect of Cyclic Thermal Stress on a Ductile Metal Coffins, L.F., Jr.;Schenectady, N.Y.
- IEEE Transactions on Components v.CHMT-6 no.3 Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling Engelmeier, W.
- Microelctronics Reliability v.40 Solder joint fatigue models :review and applicability to chip scale pachage W.W. Lee;L.T. Naguyen
- Advanced in Elctronic Packaging ASME v.10 no.2 Optimizing the Reliability of Thin SmallOutline Pachage(TSOP) Solder Joints Robert Darveaux
- Advanced in Elctronic Packaging ASME v.4 no.2 Advantages and Disadvantages of TSOP with Copper Gull-WingLeads John H. Lau;Suresh Golwalker;Steve Erasmus
- Microjoining and Assembly Technology in Electronics '99 Creep Effects on Solder Fatigue and Life Time Prediction K. Maeda