Surface Hardening Technology of the Metal by High Temperature Pulsed Plasma Flux

High Temperature Pulsed Plasma Flux 응용 금속 표면경화 공정기술

  • 권식철 (한국기계연구원 표면기술부) ;
  • 채병규 (한국전자통신연구원) ;
  • 이건환 (한국기계연구원 표면기술부) ;
  • 백운승 (한국기계연구원 표면기술부 및 엘트론)
  • Published : 2001.08.01

Abstract

The new development of the surface hardening technology has been attracted to machine designer and materials scientist in the view point of improvement in the lifetime and performance of the machine. The heat-treatment process has been a well-known technology to make harden the metal surface despite of its inefficiency in productivity and its inherent environmental pollution problem. Therefore, the plasma technology has been applied to the conventional process to improve the above issues and become successful in diminishing the ecological harmfulness. However, the drastic short processing time has been sought to increase the productivity by means of new plasma technology so-called, high temperature pulsed plasma flux (HTPPF). The basic principle and features of this HTPPF will be introduced and the present status of this technology will be described in this paper.

Keywords

References

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