대한전기학회논문지:전기물성ㆍ응용부문C (The Transactions of the Korean Institute of Electrical Engineers C)

대한전기학회 (The Korean Institute of Electrical Engineers)
권호 표지

Pull-in과 release 전압차 감소용 돌기구조를 갖는 비틀림형 초소형 기계적 스위칭 소자

Torsional Micromechanical Switching Element Including Bumps for Reducing the Voltage Difference Between Pull-in and Release

  • 발행 : 2001.09.01
PDF 다운로드
⟨ 이전 논문 다음 논문 ⟩

초록

ln this paper, a micromachined micromechanical switch is presented. The presented switch is operated in the vertical direction to the substrate by an electrostatic force between two parallel plates. The moving plate is pulled down to connect the bumps of the bias node$(V_{DD}/ or GND)$ to the bumps of the output node when a oltage difference exists between the moving plate and the input plate. The switch was designed to operate at a low switching voltage$(\risingdotseq5V)$ by including a large-area, narrow-gap, parallel plate capacitor A theoretical analysis of the designed switch was performed in order to determine its geometry fitting the desired pull-in voltage and release voltage. The designed switch was fabricated by surface micromachining combined with Ni electroplating. From the experimental results of the fabricated switch, its pull-in voltage came Out to be less than 5V and the measured maximum allowable current was 150mA. The measured average ON-state resistance was about 8$\Omega$, and the OFF-state resistance was too high to be measured with digital multimeter.

키워드

참고문헌

  1. N. Asada, H. Matsuki and Masayoshi Esashi, 'A Fail-Safe Logic Operator Using and Insulated Planar Transformer,' Elec. Eng. in Japan, Vol. 115, No. 2, pp. 115-122, 1995
  2. M. E. McNie, K. M. Brunson, D. O. King and A. R. D. Jones, 'Low Threshold Polysilicon Micro-mechanical Switches,' Transducers'99, Sendai, Japan, pp. 1834-1837, June 7-10 1999
  3. A. Hirata, K. Machida, H. Kyuragi, and M. Maeda, 'A Micromechanical Switch as The Logic Elecments for Circuits Multi Chip Module on Si(MCM-Si),' Proc. IEEE MEMS Conference '99, pp. 582-587, 1999 https://doi.org/10.1109/MEMSYS.1999.746893
  4. Ezekiel J. J. Kruglick and Kristofer S. J. Pister, 'MEMS Relay Basde Digital Logic System,' Transducers '99, Sendai, Japan, pp. 818-821, June 7-10 1999
  5. Kyoungsoo Chae, Seungoh Han, Jongmin Ha, Sung Moon, Jungho Pak, 'Design and Fabrication of a Micromechanical Switch Using PolySilicon Surface Micromachining,' Trans. KIEE, Vol. 49C, No. 9, pp. 546-552, 2000
  6. D. C. Miller, W. Zhang, and V. M. Bright, 'Microrelay packaging technology using flip-chip assembly,' Proc. IEEE MEMS Conference, pp. 265-270, 2000 https://doi.org/10.1109/MEMSYS.2000.838527
  7. A. Hirata, K. Machida, H. Kyuragi and M. Maeda, 'A micromechanical switch as the logic elements for circuits in multi chip module on Si (MCM-Si),' Proc. IEEE MEMS Conference, pp. 582-587, 1999 https://doi.org/10.1109/MEMSYS.1999.746893
  8. Kurt E. Petersen, 'Silicon torsional scanning mirror,' IBM J. Res. Develop., Vol. 24, No. 5, pp. 631-637, 1980
  9. J. Wong, J. H. Lang, and M. A. Schmidt, 'An electrostatically-actuated MEMS switch for power applications,' Proc. IEEE MEMS Conference, pp. 633-638, 2000 https://doi.org/10.1109/MEMSYS.2000.838592
  10. A. Rump et al., 'Investigating mechanical of adhesion in MEMS by capacitance-voltage measurements with micromachined comb-structures,' Transducers '99, Sendai, Japan, pp. 500-503, June 7-10, 1999