References
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- Noise Reduction Techniques in Electronic Systems Henry W. Ott
- IEEE 7th Topical Meeting Elect. Perform. Electron. Packag. ESR and ESL of ceramic capacitor applied to decoupling applications T. Roy;L. Smith
- IEEE Trans. Electromagn. Compat. v.34 no.2 Effectiveness of multiple decoupling capacitors C. R. Paul
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- IEEE Trans. Comp. Packag. Manufact. Technol. B v.19 no.1 High frequency measurement of multilayer ceramic capacitors Y. Sakabe;M. Hayashi;T. Ozaki;James P. Canner
- IEEE Microwave Magazine v.1 no.1 Component modeling for PCB design Thomas A. Winslow
- Printed Circuit Board Design Techniques for EMC Compliance M. I. Montrose
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- IEEE Trans. Comp. Packag. Manufact. Technol. B v.18 no.4 Modeling and analysis of multichip module power supply planes K. Lee;A. Barber
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- IEEE Electromagnetic Compatibility Symposium Digest Analysis and modeling of power distribution networks and lane structures in multichip module and PCBs F. Y. Yuan;T. K. Postel;L. M. Robin
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