Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
권호 표지

Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application

플립칩용 웨이퍼레벨 Fine Pitch 솔더범프 형성

  • Published : 2001.11.01
Download PDF
⟨ Previous Next ⟩

Abstract

Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

Keywords

References

  1. IEEE Electronic Components and Technology Conference Fast static RAM level two cache MCM with gold wire ball bumped flip chip assembly Leo Higgins;Rebecca Cole;Diana Duane
  2. IEEE Radio Frequency Integrated Circuits Symposium 76GHz flip-chip MMICs for automotive radars T.Shimura;Y. Kawasaki;Y. Ohashi;K. Shirakawa;T. Hirose;S. Aoki;H. Someta;K. Makiyama;S. Yokokawa
  3. IEEE Tr. on components, packaging and manufacturing technology-Part B v.20 no.3 High Density Packaging of X-Band Active Array Modules Mark S. Hauhe;John J. Wooldridge
  4. IEEE Tr. on Electronics Packaging Manufacturing v.22 no.1 The flip chip bump interconnection for millimeter wave GaAs MMIC Hideki Kusamitsu;Yoshiaki Morishita;Kenichi Maruhashi;Masaharu Ito;Keiichi Ohata
  5. IEEE Tr. on Microwave Theory and Techniques v.46 no.12 Millimeter wave characteristics of flip chip interconnection for multichip module Wolfgang Heinrich;Andrea Jentzsch;Guido Baumann
  6. Proceedings of the International Conference on Multichip Modules and High Density Packaging Transcription solder bump technology using the evaporation method K. Seyama;H. Yamamoto;K. Satou;H. Yoshimura;H. Ota;Y. Usui
  7. Electronics Manufacturing Technology Symposium Process control of high density solder bumps byelectroplating technology Szu-Wei Lu;Zhao-Hui Wu;Yuh-Jiau Huang;Ruoh-Huey Uang;Wei-Chung Lo;Hsu-Tien Hu;Yu-Fang Chen;Ling-Chen Kung;Hsin-Chien Huang
  8. Electronics Manufacturing Technology Symposium A study on the reliability of stencil printed solder bumps Ho-Cheol Jang;Chul-Won Jee;Young-Ho Kim;In-Bae Park;Sung-Min Seo;Byung-Yul Min
  9. IEEE Electronic Components and Technology Conference Micro-Ball Water Bumping for Flip Chip Interconnection Eiji Hashino;Kenji Shimokawa;Yukihiro Yamamoto;Kohei Tatsumi