감광성 BCB를 이용한 절연막층에서의 비아형성

Via Formation in Dielectric Layers Made of Photosensitive BCB

  • 발행 : 2001.05.01

초록

Via for achieving reliable fabrication of MCM(Multichip Module) substrate was formed on photosensitive BCB layer. The MCM substrate consists of photosensitive BCB(Benzocyclobutene) interlayer dielectric and copper conductors. In order to form the vias in the photosensitive BCB layer, the process of forming the BCB layer and its via forming plasma etch using C$_2$F$\_$6//O$_2$ gas were evaluated. The thickness of the BCB layer after hard bake was shrunk down to 40% of the original. The resolution of vias formed on the BCB was 15㎛ and the slope after develop was 85 degree. AES analysis was done on two vias, one is etched in C$_2$F$\_$6/O$_2$ gas and the other isnot etched. On the via etched in C$_2$F$\_$6//O$_2$, native C was detected and the amount of native C was reduced after Ar sputter. On the via not etched in C$_2$F$\_$6//O$_2$, organic C was detected. As a result of AES, BCB residue was not removed by Ar sputter, so plasma etch is necessary for achieving reliable vias.

키워드

참고문헌

  1. Proceedings of 43rd ECTC Approaches to Cost reducing MCM-DSubstrate T. Tessier;E. Myszka
  2. Proceeings of the International Conference on Multichip Modules Economic Evaluation of deposited Dielectric MCM Manufacturing Cost R. H. Heistand;D. C. Frye;D. C. Brudeaux;J. N. Carr;P. E. Garrou
  3. Thin Film Mitichip Modules Materialsof Construction: Substrate, Dielectic, Metallization P. E. Garrou;I. Turlik;G. Messner;I. Turlik:J. W. Baldeane;P. E. Garrou(eds.)
  4. MRS Symposium Proceedings v.Vil. 203 Moisture Uptake of BisBenzocyclobutene(BCB) Films for Electronic Packaging Applications H. Pranjoto;D. D. Denton
  5. Proceedings of the International Conference on Multichip Modules MCM-D Fabrication with Photosensitive Benzocyclobutene(Processing, Solder Bumping, System Assenbly, and testing) A. J. G. Strandjord;Y. Ida;P. E. Garrou;W. B. Rogers;S.L.Cummings;S. R. Kisting
  6. Proceedings of the Third International Display Workshop Super high Aperture Ratio TFT-LCD Sturcture J. H. Kim;K. N. Lim;Y. J. Oh;S. H. Lee;Y. M. Ha;H. S. Soy
  7. Cost Effective Lithography Symposium Photosensitive Benzocyclobutene for stress Buffer and Passivation Applications Andraw, J. G. Strandjord;Robert, R. DeVellis;W. Boyd Rogers;Philip E. Garrou;Eric S. Moyer;Gerg S. Becker