무전해 동도금 직물의 산화방지코팅에 관한 연구

Corrosion Protection for Electroless Cu Plated PET by Surface Confined Additives

  • 오경화 (중앙대학교 가정교육학과)
  • 발행 : 2001.06.01

초록

Protective films consisting of ultra thin, closely packed, highly water repellent polymers were prepared by sequential treatment with alkanethiol, reactive silicones, and mercaptosilane. 1-dodecanethiol was adsorbed from the ethanol solution onto the oxide free surface of Cu plated polyester fabric(Thiol). Mixture of hydroxy-terminated dimethyl-siloxane and dimethyl-methoxy-siloxane dissolved in toluene was applied onto the Cu plated fabric with adhesion promoter and catalyst(Silicone). In addition, modified self-assembled thiol and silicone layers on the copper surface were chemically prepared by sequential reactions with 1, 6-hexadecanedithiol, 3-mercaptopropandiol and silicone(ThSiA) or 3-mercaptopropyltrimethoxysilane and silicone(ThSiB) to form densely packed water repellent layers. The protection abilities of coating layer against copper corrosion were evaluated by changes in electrical conductivity, EMI-SE, color, and surface roughness after immersion in 1% NaCl solution for specified time up to 10 hrs, and after storing in the ambient atmosphere for 1 year. No apparent changes in the conductivity and EMI-SE were observed after abrading the coated fabrics over 50 cycles, whereas those of uncoated Cu plated fabrics were significantly reduced. Cu plated fabric coated with various alkanethiol and silicone layers showed good corrosion protection when they were exposed to 1% NaCl solution for 10 hrs and to the ambient atmosphere for 1 year. The effectiveness of the protection decreased in the following order Silicone > ThSiA > Thiol. We conclude that combination of mercaptosilane and silicone polymer of high molecular weight could provide effective protection layer against corrosion with good adhesion and water repellent properties.

키워드

참고문헌

  1. J. Korean Soc. Clothing and Texiles v.23 E. G. Han;K. W. Oh;E. A. Kim
  2. Innovation 128 S. A. Electrimanetic Ineterference Shielding-A Materials Perspective
  3. Functional Fibers Y. Washino
  4. Plating & Surface Finishing v.82 C. A. Deckert
  5. J. Electrochem. Soc. v.143 M. Charbonnier;M. alami;M. Romand
  6. J. Electrochem. Soc. v.146 S. Karmalkar;J. Banerjee
  7. J. Electrochem. Soc. v.144 E. D. Eliadis;R. G. Nuzzo;A. A. Gewirth;R. C. Alkire
  8. J. Electrochem. Soc. v.143 C. H. Yang;Y. Y. Wang;C. C. Wan;C. J. Chen
  9. KINITI Technical Report No. 90 Trend in Electroles Nickel Plating H. G. Lee
  10. Thin Soild Films v.213 M. L. Chou;N. Manning;H. Chen
  11. J. Electrochem. Soc. v.117 R. Sard
  12. J. Electrochem. Soc. v.144 Y. Feng;W. Teo;K. Sow;Z. Gao;K. Tan;A. Hsieh
  13. J. Electrochem. Soc. v.144 R. Haneda;H. Nishihara;K. Aramaki
  14. J. Electrochem. Soc. v.141 M. Itoh;H. Nishihara;K. Aramaki
  15. Polymer(Korea) v.25 K. W. Oh;D. J. Kim;S. H. Kim
  16. Korean J. Material Res. v.9 Y. S. Kim;I. G. Choi;S. S. Kim
  17. J. Appl. Polym. Sci. v.54 J. T. Muellerleile;J. J. Freeman
  18. Appl. Phys. Lett. v.64 J. A. M. Sondag-Heuthorst;H. R. J. van Hellepute;L. G. Fokkink
  19. J. Electrochem. Soc. v.142 T. P. Moffatt;H. Yang
  20. J. Am. Chem. Soc. v.114 P. E. Laibinis;G. M. Whitesides
  21. J. Soc. Dyers and Colorists v.113 K. Oh;M. Park;T. Kang