참고문헌
- Chip-Size Packaging Developments R.T.Crowley;T.W.Goodman;E.J.Vardaman
- Microelectronics Packaging Handbook R.R.Tummala;E.J.Rymaszewski
- IEEE Proceedings High-frequency inductance measurements and characterization of alloy 42 and copper package C.T.Tsai
- Transmission Lines in Computer Engineering S.Rosenstark
- Rambus Developer Forum Rambus Inc.
- RIMM design Training Class Rambus Inc.
- EIA/JEDEC Std JESD22-A113-B Preconditioning of nonhermetic surface mount device prior to reliability testing EIA/JEDEC Std.
- IPC/JEDECJ-STD-020A Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device, Joint Industry Standard IPC