Structure & Mechanical Behavior of TiCN Thin Films by rf Plasma Deposition

RF Plasma법으로 증착된 TiCN박막의 구조 및 기계적 거동에 관한 연구

  • Baeg, C.H. (Department of Materials Engineering, Chungbuk National University) ;
  • Park, S.Y. (Department of Materials Engineering, Chungbuk National University) ;
  • Hong, J.W. (Department of Materials Engineering, Chungbuk National University) ;
  • Wey, M.Y. (Department of Materials Engineering, Chungbuk National University) ;
  • Kang, H.J. (Department of Physics, Chungbuk National University)
  • 백창현 (충북대학교 공과대학 재료공학과) ;
  • 박상렬 (충북대학교 공과대학 재료공학과) ;
  • 홍주화 (충북대학교 공과대학 재료공학과) ;
  • 위명용 (충북대학교 공과대학 재료공학과) ;
  • 강희재 (자연과학대학 물리학과)
  • Received : 1999.12.14
  • Published : 2000.03.30

Abstract

The structure and mechanical properties of TiN and TiCN thin films deposited on STD61 steel substrates by the RF-sputtering methods has been studied by using XPS, XRD, micro-hardness tester, scratch tester, and wear-resistance tester. XPS results showed that the TiCN thin film formed with chemical bonding state. The TiN thin films grew with (111) orientation having the lowest strain energy by compressive stress, whereas the TiCN thin films grew with both (111) and (200) orientation, but (200) orientation having the lowest surface energy becomes dominant as carbon contents increase. The pre-etching treatment of substrate did not affect on the preferred orientation of thin films, but it played an important role in improving mechanical properties of thin films such as the hardness, adhesion and wear- resistance. Especially, the TiCN thin films showed the superior wear resistances due to high hardness and low friction coefficient compared with TiN thin films.

Keywords

Acknowledgement

Supported by : 학술진흥재단